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Co-authors
(38)
Takashi Yamauchi
2
KUNIHIRO TSUBOSAKI
2
Sumio Hosaka
2
Yasuhiko Nakashima
2
TOMOKO HIGASHINO
2
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(6)
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1
ECTC
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(6)
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Authors
Katsutoshi Mine
Katsutoshi Mine,Kyushu Institute of Technology,Electrical & Electronic Engineering,Industrial Engineering,Manufacturing Technology
Edit
Katsutoshi Mine
Kyushu Institute of Technology
Publications:
12
|
Citations:
9
Fields:
Electrical & Electronic Engineering
,
Industrial Engineering
,
Manufacturing Technology
View FAQ about top research areas and Fields of study
Collaborated with
38 co-authors
from 1990 to 2010
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Cited by
28 authors
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Publications
(12)
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Thermal probe measurements of energy flux onto a substrate during ICP assisted sputter-deposition
H. Kitagawa
,
R. Kan
,
K. Mine
,
M. Shinohara
,
Y. Matsuda
Conference:
TENCON, IEEE Region 10 International Conference - TENCON
, pp. 2208-2212, 2010
D abstraction by H at a D-saturated Ru(0 0 1) surface
T. Yamauchi
,
Y. Nakashima
,
T. Misumi
,
K. Mine
,
A. Namiki
Journal:
Surface Science - SURFACE SCI
, vol. 603, no. 15, pp. 2333-2339, 2009
Crystallization of D 2O thin films on Ru(0 0 1) surfaces
T. Yamauchi
,
K. Mine
,
Y. Nakashima
,
A. Izumi
,
A. Namiki
Journal:
Applied Surface Science - APPL SURF SCI
, vol. 256, no. 4, pp. 1124-1127, 2009
Possibility to detect Raman spectrum using atomic force cantilevered SNOM with aperture-less pyramidal probe
S. Hosaka
,
H. Koyabu
,
K. Mine
,
Y. Aramomi
,
H. Sone
,
E. Sato
,
K. Tochigi
Conference:
IEEE Conference on Electron Devices and Solid-State Circuits - EDSSC
, 2007
Possibility to read out 20-nm-sized pits using a near-field optical probe in an atomic force cantilevered snom
S. Hosaka
,
K. Mine
,
K. Shimada
,
M. Asai
,
Hayato
Conference:
International Conference on Solid-State and Integrated Circuit Technology - ICSICT
, 2006
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Citations
(9 times by 9 publications)
A Smart Skin PVC Foil Based on FBG Sensors for Monitoring Strain and Temperature
Alexandre Ferreira da Silva
,
Anselmo Filipe Goncalves
,
Luís Alberto de Almeida Ferreira
,
Francisco Manuel Moita Araujo
,
Paulo Mateus Mendes
,
José Higino Correia
Journal:
IEEE Transactions on Industrial Electronics - IEEE TRANS IND ELECTRON
, vol. 58, no. 7, pp. 2728-2735, 2011
Ag–Copper Structure for Bonding Large Semiconductor Chips
Jong Sung Kim
,
Pin J. Wang
,
Chin C. Lee
Journal:
IEEE Transactions on Components and Packaging Technologies - IEEE TRANS COMPON PACKAGING T
, vol. 31, no. 4, pp. 875-879, 2008
Adhesive Strength of Rubber Bonded to Al2O3 Surfaces: The Role of Chemistry and Morphology
J. Browning
,
N. Newman
,
R. Ghetzler
,
M. Mast
,
B. Swendson
Journal:
Journal of Adhesion - J ADHES
, vol. 75, no. 2, pp. 229-253, 2001
Separation of low molecular siloxanes for electronic application by liquid-liquid extraction
(
Citations: 2
)
Naoyuki Urasaki
,
C. P. Wong
Journal:
IEEE Transactions on Electronics Packaging Manufacturing - IEEE TRANS ELECTRON PACKAG MA
, vol. 22, no. 4, pp. 295-298, 1999
Separation of low molecular siloxanes for electronic application by liquid-liquid extraction [packaging materials]
Naoyuki Urasaki
,
C. P. Wong
Conference:
International Symposium on Advanced Packaging Materials - APM
, 1999
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