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(761)
Rolf Aschenbrenner
78
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56
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50
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42
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Academic
Authors
Herbert Reichl
Herbert Reichl,Technical University of Berlin,Electrical & Electronic Engineering,Manufacturing Technology,Nanotechnology
Edit
Herbert Reichl
Technical University of Berlin
Publications:
488
|
Citations:
1883
Fields:
Electrical & Electronic Engineering
,
Manufacturing Technology
,
Nanotechnology
View FAQ about top research areas and Fields of study
Collaborated with
761 co-authors
from 1983 to 2011
|
Cited by
3691 authors
Cumulative
Annual
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Publications
(488)
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RefWorks
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Influences of current collector foils with different opening ratios in passive polymer electrolyte membrane fuel cells
S. Krumbholz
,
J. Kaiser
,
M. Weiland
,
R. Hahn
,
H. Reichl
Journal:
Lancet
, vol. 196, no. 12, pp. 5277-5281, 2011
The impact of moisture absorption on the electrical characteristics of organic dielectric materials
Brian Curran
,
Ivan Ndip
,
Jorg Bauer
,
Stephan Guttowskil
,
Klaus Dieter Langl
,
Herbert Reichl
Conference:
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE - EuroSimE
, 2011
Reliability Investigation of Large GaAs Pixel Detectors Flip-Chip-Bonded on Si Readout Chips
Matthias Klein
,
Matthias Hutter
,
Gunter Engelmann
,
Thomas Fritzsch
,
Hermann Oppermann
,
Lothar Dietrich
,
M. Jürgen Wolf
,
Birgit Bramer
,
Rainer Dudek
,
Herbert Reichl
Published in 2011.
Simulation and experimental analysis of large area substrate overmolding with epoxy molding compounds
Thomas Schreier-Alt
,
Frank Rehme
,
Frank Ansorge
,
Herbert Reichl
Journal:
Microelectronics Reliability
, vol. 51, no. 3, pp. 668-675, 2011
Prospects and limits in wafer-level-packaging of image sensors
Martin Wilke
,
Frank Wippermann
,
Kai Zoschke
,
Michael Toepper
,
Oswin Ehrmann
,
Herbert Reichl
,
Klaus-Dieter Lang
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1901-1907, 2011
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Citations
(1883 times by 1463 publications)
Evaluation of sustainability using an integrated approach at process and product level: a case study
S. Vinodh
,
M. Prasanna
,
K. Eazhil Selvan
Journal:
International Journal of Sustainable Engineering
, vol. ahead-of-p, no. ahead-of-p, pp. 1-11, 2012
USING IMPEDANCE CONTROL METHOD TO ACHIEVE SIGNAL INTEGRITY IN BIOMEDICAL EQUIPMENT
Surender Singh
,
Ravinder Agarwal
,
V. R. Singh
Journal:
Instrumentation Science & Technology - INSTRUM SCI TECHNOL
, vol. just-accep, no. just-accep, 2012
Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring
(
Citations: 2
)
Jonghyun Cho
,
Eakhwan Song
,
Kihyun Yoon
,
Jun So Pak
,
Joohee Kim
,
Woojin Lee
,
Taigon Song
,
Kiyeong Kim
,
Junho Lee
,
Hyungdong Lee
,
Seungtaek Yang
,
Minsuk Suh
http://academic.research.microsoft.com/io.ashx?type=5&id=51178760&selfId1=12629995&selfId2=0&maxNumber=12&query=
Published in 2011.
A life-cycle assessment for eco-redesign of a consumer electronic product
(
Citations: 2
)
Winco K. C. Yung
,
H. K. Chan
,
Joey H. T. So
,
Danny W. C. Wong
,
Albert C. K. Choi
,
T. M. Yue
Journal:
Journal of Engineering Design - J ENGINEERING DESIGN
, vol. 22, no. 2, pp. 69-85, 2011
Experimental contact angle determination and characterisation of interfacial energies by molecular modelling of chip to epoxy interfaces
(
Citations: 2
)
O. Holck
,
J. Bauer
,
O. Wittler
,
K. D. Lang
,
B. Michel
,
B. Wunderle
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1079-1085, 2011
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