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Co-authors
(53)
Joung-Ho Kim
47
Jun-Ho Lee
18
Hyungdong Lee
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Jonghyun Cho
18
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16
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Authors
Jun So Pak
Jun So Pak,Korea Advanced Institute of Science & Technology,Electrical & Electronic Engineering,Manufacturing Technology,Networks & Communications
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Jun So Pak
Korea Advanced Institute of Science & Technology
Publications:
49
|
Citations:
140
Fields:
Electrical & Electronic Engineering
,
Manufacturing Technology
,
Networks & Communications
View FAQ about top research areas and Fields of study
Collaborated with
53 co-authors
from 2003 to 2012
|
Cited by
287 authors
Cumulative
Annual
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Publications
(49)
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Design and implementation of on-chip embedded current probe using magnetic field coupling in chip to chip wireless power transfer system
Changhyun Cho
,
Jonghyun Cho
,
Myunghoi Kim
,
Joungho Kim
,
Jun So Pak
Conference:
IEEE International Memory Workshop, IMW - IMW
, 2012
Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring
(
Citations: 2
)
Jonghyun Cho
,
Eakhwan Song
,
Kihyun Yoon
,
Jun So Pak
,
Joohee Kim
,
Woojin Lee
,
Taigon Song
,
Kiyeong Kim
,
Junho Lee
,
Hyungdong Lee
,
Seungtaek Yang
,
Minsuk Suh
http://academic.research.microsoft.com/io.ashx?type=5&id=51178760&selfId1=12724925&selfId2=0&maxNumber=12&query=
Published in 2011.
High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV)
(
Citations: 2
)
Joohee Kim
,
Jun So Pak
,
Jonghyun Cho
,
Eakhwan Song
,
Jeonghyeon Cho
,
Heegon Kim
,
Taigon Song
,
Junho Lee
,
Hyungdong Lee
,
Seungtaek Yang
,
Min-Suk Suh
,
Kwang-Yoo Byun
http://academic.research.microsoft.com/io.ashx?type=5&id=51178762&selfId1=12724925&selfId2=0&maxNumber=12&query=
Published in 2011.
Mixed-Mode ABCD Parameters: Theory and Application to Signal Integrity Analysis of PCB-Level Differential Interconnects
(
Citations: 1
)
Jeonghyeon Cho
,
Eakhwan Song
,
Heegon Kim
,
Seungyoung Ahn
,
Jun So Pak
,
Jiseong Kim
,
Joungho Kim
Journal:
IEEE Transactions on Electromagnetic Compatibility - IEEE TRANS ELECTROMAGN COMPAT
, vol. 53, no. 3, pp. 814-822, 2011
PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models
(
Citations: 1
)
Jun So Pak
,
Joohee Kim
,
Jonghyun Cho
,
Kiyeong Kim
,
Taigon Song
,
Seungyoung Ahn
,
Junho Lee
,
Hyungdong Lee
,
Joungho Kim
Published in 2011.
Sort by:
Citations
(140 times by 112 publications)
Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring
(
Citations: 2
)
Jonghyun Cho
,
Eakhwan Song
,
Kihyun Yoon
,
Jun So Pak
,
Joohee Kim
,
Woojin Lee
,
Taigon Song
,
Kiyeong Kim
,
Junho Lee
,
Hyungdong Lee
,
Seungtaek Yang
,
Minsuk Suh
http://academic.research.microsoft.com/io.ashx?type=5&id=51178760&selfId1=12724925&selfId2=0&maxNumber=12&query=
Published in 2011.
PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models
(
Citations: 1
)
Jun So Pak
,
Joohee Kim
,
Jonghyun Cho
,
Kiyeong Kim
,
Taigon Song
,
Seungyoung Ahn
,
Junho Lee
,
Hyungdong Lee
,
Joungho Kim
Published in 2011.
Through-Strata-Via (TSV) Parasitics and Wideband Modeling for Three-Dimensional Integration/Packaging
(
Citations: 1
)
Zheng Xu
,
Jian-Qiang Lu
Journal:
IEEE Electron Device Letters - IEEE ELECTRON DEV LETT
, vol. 32, no. 9, pp. 1278-1280, 2011
Electrical characterization of differential stretchable transmission line
Jae-Wan Jeon
,
Seong-Kyun Kim
,
Ja-Myeong Koo
,
Soon-Min Hong
,
Young-Jun Moon
,
Seung-Boo Jung
,
Byung-Sung Kim
Conference:
Microwave, MTT-S International Symposium - MTT
, pp. 1-4, 2011
Extraction of equivalent high frequency models for TSV and RDL interconnects embedded in stacks of the 3D integration technology
L. Fourneaud
,
T. Lacrevaz
,
J. Charbonnier
,
C. Fuchs
,
A. Farcy
,
C. Bermond
,
E. Eid
,
J. Roullard
,
B. Flechet
Conference:
IEEE Workshop on Signal Propagation on Interconnects - SPI
, 2011
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