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Co-authors
(4)
Abhijit Dasgupta
3
Puneet Sharma
2
Michael G. Pecht
1
Leon Lantz
1
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(1)
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Authors
K. Upadhyayula
K. Upadhyayula,University of Maryland,Algorithms & Theory,Software Engineering,Mechanical Engineering
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K. Upadhyayula
University of Maryland
Publications:
4
|
Citations:
26
Fields:
Algorithms & Theory
,
Software Engineering
,
Mechanical Engineering
View FAQ about top research areas and Fields of study
Collaborated with
4 co-authors
from 1998 to 2001
|
Cited by
65 authors
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Annual
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Publications
(4)
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RefWorks
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MicroMechanics of Fatigue Damage in Pb-Sn Solder Due to Vibration and Thermal Cycling
(
Citations: 10
)
A. Dasgupta
,
P. Sharma
,
K. Upadhyayula
Journal:
International Journal of Damage Mechanics - INT J DAMAGE MECH
, vol. 10, no. 2, pp. 101-132, 2001
Physics-of-failure guidelines for accelerated qualification of electronic systems
(
Citations: 10
)
Kumar Upadhyayula
,
Abhijit Dasgupta
Journal:
Quality and Reliability Engineering International
, vol. 14, no. 6, pp. 433-447, 1998
Guidelines for physics-of-failure based accelerated stress testing
(
Citations: 6
)
K. Upadhyayula
,
A. Dasgupta
Conference:
Reliability and Maintainability Annual Symposium - RAMS
, pp. 345-357, 1998
Impact of pre-conditioning, voltage bias and temperature on reliability of plastic encapsulated microcircuits
P Sharma
,
K Upadhyayula
,
L Lantz
,
M Pecht
Journal:
Microelectronics Reliability
, vol. 38, no. 4, pp. 581-584, 1998
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Citations
(26 times by 26 publications)
Board-Level Vibration Failure Criteria for Printed Circuit Assemblies: An Experimental Approach
R. A. Amy
,
G. S. Aglietti
,
G. Richardson
Journal:
IEEE Transactions on Electronics Packaging Manufacturing - IEEE TRANS ELECTRON PACKAG MA
, vol. 33, no. 4, pp. 303-311, 2010
Reliability estimation by ALT when no analytical model holds
F. Guérin
,
R. Hambli
Journal:
Quality and Reliability Engineering International
, vol. 26, no. 6, pp. 605-613, 2010
Prognostics-based product qualification
(
Citations: 3
)
Michael Pecht
,
Jie Gu
Published in 2009.
Computer Usage Monitoring for Design and Reliability Tests
(
Citations: 3
)
Jie Gu
,
Nikhil M. Vichare
,
Ed C. Tinsley
,
Michael G. Pecht
Journal:
IEEE Transactions on Components and Packaging Technologies - IEEE TRANS COMPON PACKAGING T
, vol. 32, no. 3, pp. 550-556, 2009
A fusion prognostics method for remaining useful life prediction of electronic products
(
Citations: 2
)
Shunfeng Cheng
,
Michael Pecht
Conference:
IEEE International Conference on Automation Science and Engineering - CASE
, 2009
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