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Co-authors
(109)
Claudius Feger
6
Hussain Shaukatullah
6
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4
Timothy Joseph Chainer
4
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Authors
Michael A. Gaynes
Michael A. Gaynes,IBM,Computer Science,Manufacturing Technology,Energy
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Michael A. Gaynes
IBM
Publications:
32
|
Citations:
160
Fields:
Computer Science
,
Manufacturing Technology
,
Energy
View FAQ about top research areas and Fields of study
Collaborated with
109 co-authors
from 1991 to 2012
|
Cited by
426 authors
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Annual
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Publications
(32)
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Server liquid cooling with chiller-less data center design to enable significant energy savings
Madhusudan Iyengar
,
Milnes David
,
Pritish Parida
,
Vinod Kamath
,
Bejoy Kochuparambil
,
David Graybill
,
Mark Schultz
,
Michael Gaynes
,
Robert Simons
,
Roger Schmidt
,
Timothy Chainer
Conference:
Semiconductor Thermal Measurement and Management IEEE Symposium - SEMI-THERM
, pp. 212-223, 2012
Experimental investigation of water cooled server microprocessors and memory devices in an energy efficient chiller-less data center
Pritish R. Parida
,
Milnes David
,
Madhusudan Iyengar
,
Mark Schultz
,
Michael Gaynes
,
Vinod Kamath
,
Bejoy Kochuparambil
,
Timothy Chainer
Conference:
Semiconductor Thermal Measurement and Management IEEE Symposium - SEMI-THERM
, pp. 224-231, 2012
Experimental characterization of an energy efficient chiller-less data center test facility with warm water cooled servers
Milnes P. David
,
Madhusudan Iyengar
,
Pritish Parida
,
Robert Simons
,
Mark Schultz
,
Michael Gaynes
,
Roger Schmidt
,
Timothy Chainer
Conference:
Semiconductor Thermal Measurement and Management IEEE Symposium - SEMI-THERM
, pp. 232-237, 2012
High performance wafer level underfill material with high filler loading
(
Citations: 1
)
Satoru Katsurayama
,
Hiroshi Suzuki
,
Jae-Woong Nah
,
Michael Gaynes
,
Claudius Feger
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 370-374, 2011
Development of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging
(
Citations: 1
)
Jae-Woong Nah
,
Michael A. Gaynes
,
Claudius Feger
,
Satoru Katsurayama
,
Hiroshi Suzuki
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1015-1022, 2011
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Citations
(160 times by 152 publications)
An Assessment of Direct Chip Cooling Enhancement Using Pin Fin
JIANPING TU
,
WALTER W. YUEN
,
YISHU GONG
Journal:
Heat Transfer Engineering - HEAT TRANSFER ENG
, vol. just-accep, no. just-accep, 2012
An Assessment of Direct Chip Cooling Enhancement Using Pin Fins
Jianping Tu
,
Walter W. Yuen
,
YISHU GONG
Journal:
Heat Transfer Engineering - HEAT TRANSFER ENG
, vol. 33, no. 10, pp. 845-852, 2012
High performance wafer level underfill material with high filler loading
(
Citations: 1
)
Satoru Katsurayama
,
Hiroshi Suzuki
,
Jae-Woong Nah
,
Michael Gaynes
,
Claudius Feger
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 370-374, 2011
Development of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging
(
Citations: 1
)
Jae-Woong Nah
,
Michael A. Gaynes
,
Claudius Feger
,
Satoru Katsurayama
,
Hiroshi Suzuki
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1015-1022, 2011
Advanced laminate carrier module warpage considerations for 32nm pb-free, FC PBGA package design and assembly
Edmund Blackshear
,
Thomas Lombardi
,
Frank Pompeo
,
Jean Audet
,
KyungMooon Kim
,
YoungHyuk Jeong
,
JoonYoung Choi
,
JoonYeob Lee
,
ChangWoo Park
,
Kyoji Kondo
,
Shunichiro Matsumoto
,
Yoichi Miyazawa
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 523-529, 2011
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