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Co-authors
(66)
Mitsumasa Koyanagi
19
Takafumi Fukushima
14
Ji Chel Bea
10
Kouji Kiyoyama
8
Toshinori Tanaka
7
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Authors
Kang Wook Lee
Kang Wook Lee,Tohoku University,Physics,Nuclear Engineering,Hardware & Architecture
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Kang Wook Lee
Tohoku University
Publications:
24
|
Citations:
220
Fields:
Physics
,
Nuclear Engineering
,
Hardware & Architecture
View FAQ about top research areas and Fields of study
Collaborated with
66 co-authors
from 1996 to 2011
|
Cited by
356 authors
Cumulative
Annual
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Publications
(24)
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Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration
(
Citations: 1
)
Takafumi Fukushima
,
Takayuki Konno
,
Eiji Iwata
,
Risato Kobayashi
,
Toshiya Kojima
,
Mariappan Murugesan
,
Ji Chel Bea
,
Kang Wook Lee
,
Tetsu Tanaka
,
Mitsumasa Koyanagi
Journal:
Micromachines
, vol. 2, no. 1, pp. 49-68, 2011
Nanoimprint of dehydrated PEDOT:PSS for organic photovoltaics
Y Yang
,
K Lee
,
K Mielczarek
,
W Hu
,
A Zakhidov
Journal:
Nanotechnology - NANOTECHNOL
, vol. 22, no. 48, 2011
Self-assembly technologies with high-precision chip alignment and fine-pitch microbump bonding for advanced die-to-wafer 3D integration
T. Fukushima
,
Y. Ohara
,
M. Murugesan
,
J.-C. Bea
,
K.-W. Lee
,
T. Tanaka
,
M. Koyanagi
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 2050-2055, 2011
Electrical evaluation of Cu contamination behavior at the backside surface of a thinned wafer by transient capacitance measurement
K.-W. Lee
,
J.-C. Bea
,
T. Fukushima
,
T. Tanaka
,
M. Koyanagi
Journal:
Semiconductor Science and Technology - SEMICOND SCI TECHNOL
, vol. 26, no. 2, 2011
Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperature
(
Citations: 1
)
T. Fukushima
,
E. Iwata
,
J. Bea
,
M. Murugesan
,
K. Lee
,
T. Tanaka
,
M. Koyanagi
Conference:
IEEE International Conference on 3D System Integration - 3DIC
, 2010
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Citations
(220 times by 157 publications)
Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS
(
Citations: 4
)
Martin Lapisa
,
Göran Stemme
,
Frank Niklaus
Journal:
IEEE Journal of Selected Topics in Quantum Electronics - IEEE J SEL TOP QUANTUM ELECTR
, vol. 17, no. 3, pp. 629-644, 2011
Heterogeneous Chip Integration Process for Flexible Wireless Microsystem Application
(
Citations: 2
)
Tzu-Yuan Chao
,
Chia-Wei Liang
,
Y. T. Cheng
,
Chien-Nan Kuo
Journal:
IEEE Transactions on Electron Devices - IEEE TRANS ELECTRON DEVICES
, vol. 58, no. 3, pp. 906-909, 2011
Three-Dimensional Hybrid Integration Technology of CMOS, MEMS, and Photonics Circuits for Optoelectronic Heterogeneous Integrated Systems
(
Citations: 2
)
Kang-Wook Lee
,
Akihiro Noriki
,
Kouji Kiyoyama
,
Takafumi Fukushima
,
Tetsu Tanaka
,
Mitsumasa Koyanagi
Journal:
IEEE Transactions on Electron Devices - IEEE TRANS ELECTRON DEVICES
, vol. 58, no. 3, pp. 748-757, 2011
3D integration review
(
Citations: 1
)
Mukta G. Farooq
,
Subramanian S. Iyer
Journal:
Science in China Series F: Information Sciences
, vol. 54, no. 5, pp. 1012-1025, 2011
Wafer-level chip scale flexible wireless microsystem fabrication
(
Citations: 1
)
Tzu-Yuan Chao
,
Y. T. Cheng
Conference:
IEEE International Conference on Micro Electro Mechanical Systems - MEMS
, pp. 344-347, 2011
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