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Co-authors
(81)
Bart Vandevelde
19
Eric Beyne
11
Riet Labie
8
Dirk Vandepitte
7
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6
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Authors
Paresh Limaye
Paresh Limaye,Catholic University of Leuven,Algorithms & Theory,Manufacturing Technology
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Paresh Limaye
Catholic University of Leuven
Publications:
26
|
Citations:
107
Fields:
Algorithms & Theory
,
Manufacturing Technology
View FAQ about top research areas and Fields of study
Collaborated with
81 co-authors
from 2004 to 2011
|
Cited by
353 authors
Cumulative
Annual
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Publications
(26)
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Zero-level packaging for (RF)MEMS implementing TSVs and metal bonding
Nga P. Pham
,
Vladimir Cherman
,
Bart Vandevelde
,
Paresh Limaye
,
Nina Tutunjyan
,
Roelof Jansen
,
Nele Van Hoovels
,
Deniz S. Tezcan
,
Philippe Soussan
,
Eric Beyne
,
Harrie A. C. Tilmans
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1588-1595, 2011
Design issues and considerations for low-cost 3D TSV IC technology
(
Citations: 23
)
G. Van der Plas
,
P. Limaye
,
A. Mercha
,
H. Oprins
,
C. Torregiani
,
S. Thijs
,
D. Linten
,
M. Stucchi
,
K. Guruprasad
,
D. Velenis
,
D. Shinichi
,
V. Cherman
http://academic.research.microsoft.com/io.ashx?type=5&id=50872310&selfId1=18031214&selfId2=0&maxNumber=12&query=
Conference:
Solid-State Circuits IEEE International Conference - ISSCC
, pp. 148-149, 2010
Cu/Sn microbumps interconnect for 3D TSV chip stacking
(
Citations: 7
)
Rahul Agarwal
,
Wenqi Zhang
,
Paresh Limaye
,
Riet Labie
,
Biljana Dimcic
,
Alain Phommahaxay
,
Philippe Soussan
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 858-863, 2010
Reliability testing of Cu-Sn intermetallic micro-bump interconnections for 3D-device stacking
(
Citations: 5
)
R. Labie
,
P. Limaye
,
K. W. Lee
,
C. J. Berry
,
E. Beyne
,
I. De Wolf
Conference:
Electronics System-Integration Technology Conference - ESTC
, 2010
Thermomechanical design of a generic 0-level MEMS package using chip capping and Through Silicon Via's
(
Citations: 2
)
B. Vandevelde
,
R. Jansen
,
S. Bouwstra
,
N. Pham
,
B. Majeed
,
P. Limaye
,
E. Beyne
,
H. A. C. Tilmans
Conference:
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE - EuroSimE
, 2010
Sort by:
Citations
(107 times by 102 publications)
PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models
(
Citations: 1
)
Jun So Pak
,
Joohee Kim
,
Jonghyun Cho
,
Kiyeong Kim
,
Taigon Song
,
Seungyoung Ahn
,
Junho Lee
,
Hyungdong Lee
,
Joungho Kim
Published in 2011.
TSV stress-aware full-chip mechanical reliability analysis and optimization for 3D IC
(
Citations: 1
)
Moongon Jung
,
Joydeep Mitra
,
David Z. Pan
,
Sung Kyu Lim
Published in 2011.
3D integration review
(
Citations: 1
)
Mukta G. Farooq
,
Subramanian S. Iyer
Journal:
Science in China Series F: Information Sciences
, vol. 54, no. 5, pp. 1012-1025, 2011
The spectral-luminescent and photochemical characteristics of several styrylcyanine dyes in solution
(
Citations: 1
)
Eldar N. Kurtaliev
,
Negmat Nizomov
,
Sherzod I. Rahimov
Journal:
Journal of Molecular Liquids - J MOL LIQ
, vol. 158, no. 1, pp. 43-49, 2011
Analysis and mitigation of lateral thermal blockage effect of through-silicon-via in 3D IC designs
Yibo Chen
,
Eren Kursun
,
Dave Motschman
,
Charles Johnson
,
Yuan Xie
Conference:
International Symposium on Low Power Electronics and Design - ISLPED
, pp. 397-402, 2011
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