Sign in
Author
|
Conference
|
Journal
|
Organization
|
Year
|
DOI
Look for results that meet for the following criteria:
since
equal to
before
between
and
Search in all fields of study
Limit my searches in the following fields of study
Agriculture Science
Arts & Humanities
Biology
Chemistry
Computer Science
Economics & Business
Engineering
Environmental Sciences
Geosciences
Material Science
Mathematics
Medicine
Physics
Social Science
Multidisciplinary
Co-authors
(393)
Xuefeng Hua
28
James W. Corbett
26
Xi Li (李曦)
22
Theodorus E. F. M. Standaert
21
Marc Schaepkens
20
Conferences
(1)
ICOPS
3
Journals
(30)
J VAC SCI TECHNOL A
88
APPL PHYS LETT
37
J APPL PHYS
25
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
24
J VAC SCI TECHNOL B
18
Keywords
(322)
Embed
Subscribe
Academic
Authors
Gottlieb S. Oehrlein
Gottlieb S. Oehrlein,University of Maryland,Electrical & Electronic Engineering,Chemical Physics & Material Physics,Condensed Matter Physics
Edit
Gottlieb S. Oehrlein
University of Maryland
Publications:
324
|
Citations:
956
Fields:
Electrical & Electronic Engineering
,
Chemical Physics & Material Physics
,
Condensed Matter Physics
View FAQ about top research areas and Fields of study
Collaborated with
393 co-authors
from 1979 to 2011
|
Cited by
1584 authors
Cumulative
Annual
Sort by:
Publications
(324)
BibTeX
|
RIS
|
RefWorks
Download
On the absence of post-plasma etch surface and line edge roughness in vinylpyridine resists
R. L. Bruce
,
F. Weilnboeck
,
T. Lin
,
R. J. Phaneuf
,
G. S. Oehrlein
,
B. K. Long
,
C. G. Willson
,
A. Alizadeh
Journal:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
, vol. 29, 2011
Atmospheric-pressure air plasma jet and its application to photoresist material etching
Lijun Wang
,
Nick Fox-Lyon
,
Florian Weilnboeck
,
Shenli Jia
,
Gottlieb Oehrlein
Conference:
IEEE International Conference on Plasma Science - ICOPS
, pp. 1-1, 2011
Influence of C[sub 4]F[sub 8]/Ar-based etching and H[sub 2]-based remote plasma ashing processes on ultralow k materials modifications
(
Citations: 2
)
Ming-Shu Kuo
,
Xuefeng Hua
,
G. S. Oehrlein
,
A. Ali
,
P. Jiang
,
P. Lazzeri
,
M. Anderle
Journal:
Journal of Vacuum Science & Technology B - J VAC SCI TECHNOL B
, vol. 28, no. 2, 2010
Photoresist modifications by plasma vacuum ultraviolet radiation: The role of polymer structure and plasma chemistry
F. Weilnboeck
,
R. L. Bruce
,
S. Engelmann
,
G. S. Oehrlein
,
D. Nest
,
T.-Y. Chung
,
D. Graves
,
M. Li
,
D. Wang
,
C. Andes
,
E. A. Hudson
Journal:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
, vol. 28, 2010
Role of polymer structure and ceiling temperature in polymer roughening and degradation during plasma processing: a beam system study of P4MS and PalphaMS
D. Nest
,
T.-Y. Chung
,
J. J. Végh
,
D. B. Graves
,
R. L. Bruce
,
T. Lin
,
R. J. Phaneuf
,
G. S. Oehrlein
,
B. K. Long
,
C. G. Willson
Journal:
Journal of Physics D-applied Physics - J PHYS-D-APPL PHYS
, vol. 43, no. 8, 2010
Sort by:
Citations
(956 times by 538 publications)
Electropolishing and electroless plating of copper and tin to replace CMP and lithographic processes in Cu/Sn bump fabrication
Myung-Won Jung
,
Seoung-Hun Kim
,
Yun-Sung Moon
,
Suk-Ei Lee
,
Yeong-Kwon Ko
,
Jae-Ho Lee
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1913-1916, 2011
Low-k etching using CF3I, a path to overcome current BEOL integration issues
Adam J. Gildea
,
Justin C. Long
,
Eric Eisenbraun
,
Vincent Omarjee
,
Nathan Stafford
,
Francois Doniat
,
Christian Dussarrat
Conference:
Advanced Semiconductor Manufacturing, IEEE/SEMI Conference and Workshop - ASMC
, pp. 1-5, 2011
Electrochemical characterization of copper chemical mechanical polishing in l -glutamic acid–hydrogen peroxide-based slurries
Noyel Victoria Selvam
,
Ramanathan Srinivasan
Journal:
Journal of Solid State Electrochemistry - J SOLID STATE ELECTROCHEM
, vol. 15, no. 4, pp. 837-844, 2011
Temperature Measurement in Rapid Thermal Processing with Focus on the Application to Flash Lamp Annealing
D. Reichel
,
W. Skorupa
,
W. Lerch
,
J. C. Gelpey
Journal:
Critical Reviews in Solid State and Materials Sciences - CRIT REV SOLID STATE MAT SCI
, vol. 36, no. 2, pp. 102-128, 2011
Influence of pH, immersion time, and benzotriazole concentration on copper corrosion in citric acid based slurries
XiaoRen Lü
,
XinChun Lu
,
JianBin Luo
Journal:
Chinese Science Bulletin - CHIN SCI BULL
, vol. 56, no. 11, pp. 1158-1164, 2011
Comments