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Co-authors
(37)
Jae-Wook Lee
2
Woo-Seop Kim
2
U. Kang
2
Seongmoo Heo
2
Hye-seon Lee (이혜선)
2
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(1)
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1
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INTEGR FERROELECTRICS
2
IEEE J SOLID-STATE CIRCUITS
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Authors
Soon-Hong Ahn
Soon-Hong Ahn,Sungkyunkwan University,Physics,Manufacturing Technology,Electrical & Electronic Engineering
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Soon-Hong Ahn
Sungkyunkwan University
Publications:
4
|
Citations:
56
Fields:
Physics
,
Manufacturing Technology
,
Electrical & Electronic Engineering
View FAQ about top research areas and Fields of study
Collaborated with
37 co-authors
from 2000 to 2010
|
Cited by
159 authors
Cumulative
Annual
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Publications
(4)
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RefWorks
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8 Gb 3-D DDR3 DRAM Using Through-Silicon-Via Technology
(
Citations: 22
)
Uksong Kang
,
Hoe-Ju Chung
,
Seongmoo Heo
,
Duk-Ha Park
,
Hoon Lee
,
Jin Ho Kim
,
Soon-Hong Ahn
,
Soo-Ho Cha
,
Jaesung Ahn
,
DukMin Kwon
,
Jae-Wook Lee
,
Han-Sung Joo
http://academic.research.microsoft.com/io.ashx?type=5&id=27053636&selfId1=22247986&selfId2=0&maxNumber=12&query=
Journal:
IEEE Journal of Solid-state Circuits - IEEE J SOLID-STATE CIRCUITS
, vol. 45, no. 1, pp. 111-119, 2010
8Gb 3D DDR3 DRAM using through-silicon-via technology
(
Citations: 34
)
Uksong Kang
,
Hoe-Ju Chung
,
Seongmoo Heo
,
Soon-Hong Ahn
,
Hoon Lee
,
Soo-Ho Cha
,
Jaesung Ahn
,
DukMin Kwon
,
Jin Ho Kim
,
Jae-Wook Lee
,
Han-Sung Joo
,
Woo-Seop Kim
http://academic.research.microsoft.com/io.ashx?type=5&id=50755398&selfId1=22247986&selfId2=0&maxNumber=12&query=
Conference:
Solid-State Circuits IEEE International Conference - ISSCC
, 2009
Hysteresis caused by defects in buffer layer of metal-ferroelectric-insulator-semiconductor (MFIS) devices
Dongseok Kang
,
Soonhong Ahn
,
Yonghan Roh
,
Sungjin Jun
,
Jaichan Lee
,
Donggeun Jung
Journal:
Integrated Ferroelectrics - INTEGR FERROELECTRICS
, vol. 40, no. 1-5, pp. 245-254, 2001
Electrical characterizations of MgTiO3 thin films grown on Si
Soonhong Ahn
,
Younghun Lee
,
Yonghan Roh
,
Shinchung Kang
,
Jaichan Lee
Journal:
Integrated Ferroelectrics - INTEGR FERROELECTRICS
, vol. 31, no. 1-4, pp. 359-366, 2000
Sort by:
Citations
(56 times by 47 publications)
PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models
(
Citations: 1
)
Jun So Pak
,
Joohee Kim
,
Jonghyun Cho
,
Kiyeong Kim
,
Taigon Song
,
Seungyoung Ahn
,
Junho Lee
,
Hyungdong Lee
,
Joungho Kim
Published in 2011.
3D integration review
(
Citations: 1
)
Mukta G. Farooq
,
Subramanian S. Iyer
Journal:
Science in China Series F: Information Sciences
, vol. 54, no. 5, pp. 1012-1025, 2011
Domain-specific processor with 3D integration for medical image processing
(
Citations: 1
)
Jason Cong
,
Karthik Guruaj
,
Muhuan Huang
,
Sen Li
,
Bingjun Xiao
,
Yi Zou
Published in 2011.
3D stackable 32nm High-K/Metal Gate SOI embedded DRAM prototype
John Golz
,
John Safran
,
Bishan He
,
Derek Leu
,
Ming Yin
,
Todd Weaver
,
Adis Vehabovic
,
Yan Sun
,
Alberto Cestero
,
Ben Himmel
,
Gary Maier
,
Chandrasekharan Kothandaraman
http://academic.research.microsoft.com/io.ashx?type=5&id=51102159&selfId1=22247986&selfId2=0&maxNumber=12&query=
Published in 2011.
NAND Flash Memory-Based SSD Controller Using Full Page-Associative Block Recycling Mechanism
Masataka Nishi
,
Koji Matsuda
,
Ryoichi Inada
,
Takuma Nishimura
,
Ryo Fujita
,
Masahiro Shiraishi
,
Koji Sumiya
,
Hisanori Okibayashi
Conference:
IEEE International Memory Workshop, IMW - IMW
, 2011
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