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Co-authors
(6)
Jae-Woong Nah
2
Michael A. Gaynes
2
Claudius Feger
2
Hiroshi I. Suzuki
2
Masumi Saka
1
Conferences
(1)
ECTC
2
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J ELECTRON PACKAGING
1
Journal of Solid Mechanics and Materials Engineering
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Authors
Satoru Katsurayama
Satoru Katsurayama,Mechanical Engineering
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Satoru Katsurayama
Publications:
4
|
Citations:
4
Fields:
Mechanical Engineering
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Collaborated with
6 co-authors
from 2008 to 2011
|
Cited by
5 authors
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Annual
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Publications
(4)
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High performance wafer level underfill material with high filler loading
(
Citations: 1
)
Satoru Katsurayama
,
Hiroshi Suzuki
,
Jae-Woong Nah
,
Michael Gaynes
,
Claudius Feger
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 370-374, 2011
Development of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging
(
Citations: 1
)
Jae-Woong Nah
,
Michael A. Gaynes
,
Claudius Feger
,
Satoru Katsurayama
,
Hiroshi Suzuki
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1015-1022, 2011
Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability
(
Citations: 1
)
Satoru Katsurayama
,
Hironori Tohmyoh
Journal:
Journal of Electronic Packaging - J ELECTRON PACKAGING
, vol. 131, no. 3, 2009
Reliability Evaluation of Warpage of Flip Chip Package with Some Kinds of Underfill Material
(
Citations: 1
)
Satoru Katsurayama
,
Masumi Saka
Journal:
Journal of Solid Mechanics and Materials Engineering
, vol. 2, no. 8, pp. 987-998, 2008
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Citations
(4 times by 3 publications)
High performance wafer level underfill material with high filler loading
(
Citations: 1
)
Satoru Katsurayama
,
Hiroshi Suzuki
,
Jae-Woong Nah
,
Michael Gaynes
,
Claudius Feger
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 370-374, 2011
Development of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging
(
Citations: 1
)
Jae-Woong Nah
,
Michael A. Gaynes
,
Claudius Feger
,
Satoru Katsurayama
,
Hiroshi Suzuki
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1015-1022, 2011
Effect of Warpage of Flip Chip Packages Due to the Underfill Encapsulating Process on Interconnect Reliability
(
Citations: 1
)
Satoru Katsurayama
,
Hironori Tohmyoh
Journal:
Journal of Electronic Packaging - J ELECTRON PACKAGING
, vol. 131, no. 3, 2009
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