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Co-authors
(73)
Werner Fischer
5
Wolfgang Rehm
4
Jochen Strunk
4
Eric Starke
4
Peter Marwedel
3
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(5)
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Authors
Andreas Heinig
Andreas Heinig,Technical University of Chemnitz,Hardware & Architecture,Aeronautics & Aerospace Engineering,Electrical & Electronic Engineering
Edit
Andreas Heinig
Technical University of Chemnitz
Publications:
20
|
Citations:
18
Fields:
Hardware & Architecture
,
Aeronautics & Aerospace Engineering
,
Electrical & Electronic Engineering
View FAQ about top research areas and Fields of study
Collaborated with
73 co-authors
from 1997 to 2011
|
Cited by
42 authors
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Annual
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Publications
(20)
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Temporal properties of error handling for multimedia applications
Michael Engel
,
Andreas Heinig
,
Florian Schmoll
,
Peter Marwedel
Published in 2011.
Automatic Extraction of Pipeline Parallelism for Embedded Software Using Linear Programming
Daniel Cordes
,
Andreas Heinig
,
Peter Marwedel
,
Arindam Mallik
Conference:
International Conference on Parallel and Distributed Systems - ICPADS
, pp. 699-706, 2011
Design and properties of a sensor network embedded in thin fiber-reinforced composites
(
Citations: 2
)
Andreas Kunadt
,
Andreas Heinig
,
Eric Starke
,
G. Pfeifer
,
C. Cheriff
,
W.-J. Fischer
Conference:
IEEE - SENSORS
, pp. 673-677, 2010
Optical wireless data transmission with a sensor network integrated in a textile-reinforced composite
(
Citations: 1
)
A. Heinig
,
F. Deicke
,
A. Kunadt
,
E. Starke
,
W.-J. Fischer
Conference:
IEEE - SENSORS
, pp. 965-969, 2010
Improving transient memory fault resilience of an H.264 decoder
Andreas Heinig
,
Michael Engel
,
Florian Schmoll
,
Peter Marwedel
Conference:
Embedded Systems for Real-Time Multimedia - ESTIMEDIA
, 2010
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Citations
(18 times by 16 publications)
TSV based silicon interposer technology for wafer level fabrication of 3D SiP modules
K. Zoschke
,
J. Wolf
,
C. Lopper
,
I. Kuna
,
N. Jurgensen
,
V. Glaw
,
K. Samulewicz
,
J. Roder
,
M. Wilke
,
O. Wunsch
,
M. Klein
,
M. V. Suchodoletz
http://academic.research.microsoft.com/io.ashx?type=5&id=51060695&selfId1=3133964&selfId2=0&maxNumber=12&query=
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 836-843, 2011
Evaluation of thin wafer processing using a temporary wafer handling system as key technology for 3D system integration
(
Citations: 4
)
K. Zoschke
,
M. Wegner
,
M. Wilke
,
N. Jurgensen
,
C. Lopper
,
I. Kuna
,
V. Glaw
,
J. Roder
,
O. Wunsch
,
M. J. Wolf
,
O. Ehrmann
,
H. Reichl
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1385-1392, 2010
Design and properties of a sensor network embedded in thin fiber-reinforced composites
(
Citations: 2
)
Andreas Kunadt
,
Andreas Heinig
,
Eric Starke
,
G. Pfeifer
,
C. Cheriff
,
W.-J. Fischer
Conference:
IEEE - SENSORS
, pp. 673-677, 2010
Optical wireless data transmission with a sensor network integrated in a textile-reinforced composite
(
Citations: 1
)
A. Heinig
,
F. Deicke
,
A. Kunadt
,
E. Starke
,
W.-J. Fischer
Conference:
IEEE - SENSORS
, pp. 965-969, 2010
Rate dependent mechanical behaviour of SAC solder in fast tensile experiments
(
Citations: 1
)
K. Meier
,
M. Roellig
,
S. Wiese
,
K.-J. Wolter
Conference:
Electronics System-Integration Technology Conference - ESTC
, 2010
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