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Hyungdong Lee

Hyungdong Lee,Seoul National University,Engineering,Information Retrieval,Networks & Communications

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Hyungdong Lee

Seoul National University

Publications: 28 | Citations: 60

Fields: Engineering, Information Retrieval, Networks & Communications

Collaborated with 45 co-authors from 2001 to 2011 | Cited by 126 authors

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Publications (28)

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Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring (Citations: 2)

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Published in 2011.

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV) (Citations: 2)

, , , , , , , , , , , http://academic.research.microsoft.com/io.ashx?type=5&id=51178762&selfId1=3385983&selfId2=0&maxNumber=12&query=

Published in 2011.

PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models (Citations: 1)

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Published in 2011.

Distributed multi TSV 3D clock distribution network in TSV-based 3D IC

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Conference: IEEE Topical Meeting on Electrical Performance of Electronic Packaging - EPEPS , 2011

Temperature-dependent through-silicon via (TSV) model and noise coupling

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Conference: IEEE Topical Meeting on Electrical Performance of Electronic Packaging - EPEPS , 2011

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Citations (60 times by 44 publications)

Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring (Citations: 2)

, , , , , , , , , , , http://academic.research.microsoft.com/io.ashx?type=5&id=51178760&selfId1=3385983&selfId2=0&maxNumber=12&query=

Published in 2011.

Through-Strata-Via (TSV) Parasitics and Wideband Modeling for Three-Dimensional Integration/Packaging (Citations: 1)

Journal: IEEE Electron Device Letters - IEEE ELECTRON DEV LETT , vol. 32, no. 9, pp. 1278-1280, 2011

Fast and Accurate Analytical Modeling of Through-Silicon-Via Capacitive Coupling (Citations: 1)

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Published in 2011.

Extraction of equivalent high frequency models for TSV and RDL interconnects embedded in stacks of the 3D integration technology

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Conference: IEEE Workshop on Signal Propagation on Interconnects - SPI , 2011

Analysis of TSV-to-TSV coupling with high-impedance termination in 3D ICs

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Conference: International Symposium on Quality Electronic Design - ISQED , pp. 122-128, 2011

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Hyungdong Lee,Seoul National University,Engineering,Information Retrieval,Networks & Communications

Publications (28) BibTeX | RIS | RefWorks Download

Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring (Citations: 2)

High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV) (Citations: 2)

PDN Impedance Modeling and Analysis of 3D TSV IC by Using Proposed P/G TSV Array Model Based on Separated P/G TSV and Chip-PDN Models (Citations: 1)

Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring (Citations: 2)

Through-Strata-Via (TSV) Parasitics and Wideband Modeling for Three-Dimensional Integration/Packaging (Citations: 1)

Fast and Accurate Analytical Modeling of Through-Silicon-Via Capacitive Coupling (Citations: 1)

Publications (28)

BibTeX | RIS | RefWorks Download