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Co-authors
(52)
Lewis S. Goldmann
3
Robert Hannon
3
Greg Martin
2
Chuck Goldsmith
2
Subramanian S. Iyer
2
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(3)
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Authors
Mukta G. Farooq
Mukta G. Farooq,IBM,Engineering,Material Science,Software Engineering
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Mukta G. Farooq
IBM
Publications:
8
|
Citations:
28
Fields:
Engineering
,
Material Science
,
Software Engineering
View FAQ about top research areas and Fields of study
Collaborated with
52 co-authors
from 2003 to 2011
|
Cited by
67 authors
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Annual
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Publications
(8)
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RefWorks
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3D integration review
(
Citations: 1
)
Mukta G. Farooq
,
Subramanian S. Iyer
Journal:
Science in China Series F: Information Sciences
, vol. 54, no. 5, pp. 1012-1025, 2011
3D copper TSV integration, testing and reliability
M. G. Farooq
,
T. L. Graves-Abe
,
W. F. Landers
,
C. Kothandaraman
,
B. A. Himmel
,
P. S. Andry
,
C. K. Tsang
,
E. Sprogis
,
R. P. Volant
,
K. S. Petrarca
,
K. R. Winstel
,
J. M. Safran
http://academic.research.microsoft.com/io.ashx?type=5&id=56990714&selfId1=34552788&selfId2=0&maxNumber=12&query=
Conference:
International Electron Devices Meeting - IEDM
, pp. 7.1.1-7.1.4, 2011
Chip Package Interaction for 65nm CMOS Technology with C4 Interconnections
(
Citations: 1
)
Mukta Farooq
,
Ian Melville
,
Christopher Muzzy
,
Paul V. McLaughlin
,
Robert Hannon
,
Wolfgang Sauter
,
Jennifer Muncy
,
David Questad
,
Charles Carey
,
Mary Cullinan-Scholl
,
Vincent McGahay
,
Matthew Angyal
http://academic.research.microsoft.com/io.ashx?type=5&id=50567663&selfId1=34552788&selfId2=0&maxNumber=12&query=
Conference:
Interconnect Technology, IEEE International Conference - IITC
, 2007
Development of BGA solution for the IBM PowerPC 970 module in Apple's Power Mac G5
(
Citations: 1
)
David Edwards
,
Hope Chambers
,
Mukta Farooq
,
Lewis Goldmann
,
Amir Salehi
Conference:
Electronic Components and Technology Conference - ECTC
, 2004
Thermomechanical fatigue reliability of Pb-free ceramic ball grid arrays: experimental data and lifetime prediction modeling
(
Citations: 11
)
Mukta Farooq
,
Lewis Goldmann
,
Gregory Martin
,
Charles Goldsmith
,
Christian Bergeron
Conference:
Electronic Components and Technology Conference - ECTC
, 2003
Sort by:
Citations
(28 times by 22 publications)
Effect of Gold Content on the Reliability of SnAgCu Solder Joints
Jianbiao Pan
,
Julie Silk
,
Mike Powers
,
Patrick Hyland
Published in 2011.
Three Dimensional integration - Considerations for memory applications
S. S. Iyer
,
T. Kirihata
,
J. E. Barth
Conference:
Custom Integrated Circuits Conference - CICC
, pp. 1-7, 2011
A Finite-Element-Based Solder-Joint Fatigue-Life Prediction Methodology for Sn–Ag–Cu Ball-Grid-Array Packages
Walter Dauksher
,
John Lau
Journal:
IEEE Transactions on Device and Materials Reliability - IEEE TRANS DEVICE MATER RELIA
, vol. 9, no. 2, pp. 231-236, 2009
Thermal Cycle Reliability and Failure Mechanisms of CCGA and PBGA Assemblies With and Without Corner Staking
(
Citations: 4
)
Reza Ghaffarian
Journal:
IEEE Transactions on Components and Packaging Technologies - IEEE TRANS COMPON PACKAGING T
, vol. 31, no. 2, pp. 285-296, 2008
Thermal Fatigue Behavior of Sn-Rich (Pb-Free) Solders
(
Citations: 5
)
R. S. Sidhu
,
N. Chawla
Journal:
Metallurgical and Materials Transactions A-physical Metallurgy and Materials Science - METALL MATER TRANS A
, vol. 39, no. 4, pp. 799-810, 2008
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