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Co-authors
(210)
Chunhu Liu
6
Chongqing Zhang
6
Vadim V. Silberschmidt
6
See Leang Chin
5
J. Bernhardt
4
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Authors
H. L. Xu
H. L. Xu,University of Alabama,Scientific Computing,Electrical & Electronic Engineering,Geosciences
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H. L. Xu
University of Alabama
Publications:
50
|
Citations:
48
Fields:
Scientific Computing
,
Electrical & Electronic Engineering
,
Geosciences
View FAQ about top research areas and Fields of study
Collaborated with
210 co-authors
from 1993 to 2011
|
Cited by
163 authors
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Annual
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Publications
(50)
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Effect of bonding duration and substrate temperature in copper ball bonding on aluminium pads: A TEM study of interfacial evolution
(
Citations: 3
)
H. Xu
,
C. Liu
,
V. V. Silberschmidt
,
Z. Chen
,
J. Wei
,
M. Sivakumar
Journal:
Microelectronics Reliability
, vol. 51, no. 1, pp. 113-118, 2011
Shape memory behavior in Ti–Zr alloys
(
Citations: 1
)
Y. Li
,
Y. Cui
,
F. Zhang
,
H. Xu
Journal:
Scripta Materialia - SCRIPTA MATER
, vol. 64, no. 6, pp. 584-587, 2011
New mechanisms of void growth in Au–Al wire bonds: Volumetric shrinkage and intermetallic oxidation
H. Xu
,
C. Liu
,
V. V. Silberschmidt
,
S. S. Pramana
,
T. J. White
,
Z. Chen
,
V. L. Acoff
Journal:
Scripta Materialia - SCRIPTA MATER
, vol. 65, no. 7, pp. 642-645, 2011
Void growth in thermosonic copper/gold wire bonding on aluminum pads
H. Xu
,
V. L. Acoff
,
C. Liu
,
V. V. Silberschmidt
,
Z. Chen
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1729-1735, 2011
Facilitating intermetallic formation in wire bonding by applying a pre-ultrasonic energy
H. Xu
,
V. L. Acoff
,
C. Liu
,
V. V. Silberschmidt
,
Z. Chen
Journal:
Microelectronic Engineering - MICROELECTRON ENG
, vol. 88, no. 10, pp. 3155-3157, 2011
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Citations
(48 times by 47 publications)
Earthquake Response Reduction of Building Structures Using Learning-Based Lattice Pattern Active Controller
Seongkyu Chang
,
Dookie Kim
,
Dong Hyawn Kim
,
Ki-Weon Kang
Journal:
Journal of Earthquake Engineering - J EARTHQU ENG
, vol. 16, no. 3, pp. 317-328, 2012
Terahertz micromachined on-wafer probes: Repeatability and robustness
(
Citations: 3
)
Lihan Chen
,
Chunhu Zhang
,
Theodore J. Reck
,
Christopher Groppil
,
Alex Arsenovic
,
Arthur Lichtenberger
,
Robert M. Weikle
,
N. Scott Barker
Conference:
Microwave, MTT-S International Symposium - MTT
, pp. 1-4, 2011
Micromachined Probes for Submillimeter-Wave On-Wafer Measurements—Part I: Mechanical Design and Characterization
(
Citations: 1
)
Theodore J. Reck
,
Lihan Chen
,
Chunhu Zhang
,
Alex Arsenovic
,
Christopher Groppi
,
Arthur W. Lichtenberger
,
Robert M. Weikle
,
N. Scott Barker
Journal:
IEEE Transactions on Terahertz Science and Technology - TTHZ
, vol. 1, no. 2, pp. 349-356, 2011
Low Noise Amplification at 0.67 THz Using 30 nm InP HEMTs
(
Citations: 1
)
William. R. Deal
,
K. Leong
,
V. Radisic
,
S. Sarkozy
,
B. Gorospe
,
J. Lee
,
P. H. Liu
,
W. Yoshida
,
J. Zhou
,
M. Lange
,
R. Lai
,
X. B. Mei
Journal:
IEEE Microwave and Wireless Components Letters - IEEE MICROW WIREL COMPON LETT
, vol. 21, no. 7, pp. 368-370, 2011
Micromachined Probes for Submillimeter-Wave On-Wafer Measurements—Part II: RF Design and Characterization
(
Citations: 1
)
Theodore J. Reck
,
Lihan Chen
,
Chunhu Zhang
,
Alex Arsenovic
,
Christopher Groppi
,
Arthur Lichtenberger
,
Robert M. Weikle
,
N. Scott Barker
Journal:
IEEE Transactions on Terahertz Science and Technology - TTHZ
, vol. 1, no. 2, pp. 357-363, 2011
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