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Co-authors
(30)
Thomas Gessner
4
Stefan E. Schulz
4
Johann W. Bartha
2
W. Gruenewald
2
Matthias Albert
2
Journals
(4)
APPL SURF SCI
4
J ELECTROCHEM SOC
1
MICROELECTRON ENG
1
Energy Procedia
1
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Academic
Authors
Bernd Hintze
Bernd Hintze,Dresden University of Technology,Electrical & Electronic Engineering,Energy,Nanotechnology
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Bernd Hintze
Dresden University of Technology
Publications:
7
|
Citations:
4
Fields:
Electrical & Electronic Engineering
,
Energy
,
Nanotechnology
View FAQ about top research areas and Fields of study
Collaborated with
30 co-authors
from 1991 to 2011
|
Cited by
12 authors
Cumulative
Annual
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Publications
(7)
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RefWorks
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Large area solar cells with efficiency exceeding 19% in pilot series designed for conventional module assembling
A. Mohr
,
S. Wanka
,
A. Stekolnikov
,
M. Scherff
,
R. Seguin
,
P. Engelhart
,
C. Klenke
,
J. Y. Lee
,
S. Tardon
,
S. Diez
,
J. Wendt
,
B. Hintze
http://academic.research.microsoft.com/io.ashx?type=5&id=49672128&selfId1=43984299&selfId2=0&maxNumber=12&query=
Journal:
Energy Procedia
, vol. 8, pp. 390-395, 2011
Atomic Layer Deposition of Ta–N-Based Thin Films Using a Tantalum Source
D. Schmidt
,
M. Knaut
,
C. Hossbach
,
M. Albert
,
C. Dussarrat
,
B. Hintze
,
J. W. Bartha
Journal:
Journal of The Electrochemical Society - J ELECTROCHEM SOC
, vol. 157, no. 6, 2010
Remote plasma etching of titanium nitride using NF 3/argon and chlorine mixtures for chamber clean applications
(
Citations: 3
)
Ronald Hellriegel
,
Matthias Albert
,
Bernd Hintze
,
Hubert Winzig
,
J. W. Bartha
Journal:
Microelectronic Engineering - MICROELECTRON ENG
, vol. 84, no. 1, pp. 37-41, 2007
Evaluation of selective tungsten plugs on TiN, W and AlSi by analytical and electrical measurements
S. E. Schulz
,
B. Hintze
,
W. Grünewald
,
O. Fiedler
,
T. Gessner
Journal:
Applied Surface Science - APPL SURF SCI
, vol. 91, no. 1, pp. 326-331, 1995
Selective tungsten CVD on sputtered tungsten for via fill
S. Schulz
,
B HINTZE
,
T GESSNER
,
H WOLF
,
W GRUENEWALD
Journal:
Applied Surface Science - APPL SURF SCI
, vol. 73, pp. 42-50, 1993
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Citations
(4 times by 4 publications)
Laser removal of TiN from coated carbide substrate
M. Sundar
,
P. T. Mativenga
,
L. Li
,
P. L. Crouse
Journal:
International Journal of Advanced Manufacturing Technology - INT J ADV MANUF TECHNOL
, vol. 45, no. 11, pp. 1169-1178, 2009
High density plasma etching of titanium nitride metal gate electrodes for fully depleted silicon-on-insulator subthreshold transistor integration
Steven A. Vitale
,
Jakub Kedzierski
,
Craig L. Keast
Journal:
Journal of Vacuum Science & Technology B - J VAC SCI TECHNOL B
, vol. 27, no. 6, 2009
Plasma reactor dry cleaning strategy after TiN, TaN and HfO[sub 2] etching processes
(
Citations: 3
)
R. Ramos
,
G. Cunge
,
O. Joubert
Journal:
Journal of Vacuum Science & Technology B - J VAC SCI TECHNOL B
, vol. 26, no. 1, 2008
Heat flow modeling of chemical vapor deposition of tungsten for improved film thickness uniformity
Julius C. Chang
,
Lisa A. Megna
Journal:
Journal of Electronic Materials - J ELECTRON MATER
, vol. 21, no. 11, pp. 1019-1025, 1992
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