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Co-authors
(26)
Kostas Masselos
3
Geert Van der Plas
3
Paul Marchal
3
Bart Vandevelde
3
Adi Srinivasan
3
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Miroslav Cupak
Miroslav Cupak (Miroslav Cupák),Interuniversity Microelectronics Center,Hardware & Architecture,Software Engineering,Distributed & Parallel Computing
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Miroslav Cupak (Miroslav Cupák)
Interuniversity Microelectronics Center
Publications:
8
|
Citations:
54
Fields:
Hardware & Architecture
,
Software Engineering
,
Distributed & Parallel Computing
View FAQ about top research areas and Fields of study
Collaborated with
26 co-authors
from 2003 to 2011
|
Cited by
136 authors
Cumulative
Annual
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Publications
(8)
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Fine grain thermal modeling and experimental validation of 3DICs
(
Citations: 3
)
H. Oprins
,
Adi Srinivasan
,
Miroslav Cupák
,
V. Cherman
,
C. Torregiani
,
Michele Stucchi
,
Geert Van der Plas
,
Paul Marchal
,
Bart Vandevelde
,
E. Cheng
Journal:
Microelectronics Journal
, vol. 42, no. 4, pp. 572-578, 2011
Experimental characterization and model validation of thermal hot spots in 3D stacked ICs
H. Oprins
,
V. Cherman
,
Adi Srinivasan
,
M. Cupak
,
G. Van der Plas
,
P. Marchal
,
B. Vandevelde
,
E. Cheng
Published in 2010.
Fine grain thermal modeling of 3D stacked structures
(
Citations: 2
)
H. Oprins
,
M. Cupak
,
G. Van der Plas
,
P. Marchal
,
B. Vandevelde
,
Adi Srinivasan
,
E. Cheng
Published in 2009.
System Level Architecture Exploration for Reconfigurable Systems On Chip
(
Citations: 1
)
Konstantinos Masselos
,
Kari Tiensyrjä
,
Yang Qu
,
Nikolaos S. Voros
,
Miroslav Cupák
,
Luc Rijnders
,
Marko Pettissalo
Conference:
Field-Programmable Logic and Applications - FPL
, pp. 1-6, 2006
SystemC and OCAPI-xl Based System-Level Design for Reconfigurable Systems-on-Chip
(
Citations: 5
)
Kari Tiensyrjä
,
Miroslav Cupák
,
Kostas Masselos
,
Marko Pettissalo
,
Konstantinos Potamianos
,
Yang Qu
,
Luc Rynders
,
Geert Vanmeerbeeck
,
Nikos Voros
,
Yan Zhang
Conference:
Forum on specification & Design Languages - FDL
, pp. 428-440, 2004
Sort by:
Citations
(54 times by 50 publications)
The Study of a Dynamic Reconfiguration Manager for Systems-on-Chip
Matthias Kuehnle
,
Alisson Brito
,
Christoph Roth
,
Konstantinos Dagas
,
Juergen Becker
Conference:
Annual Symposium on VLSI
, pp. 13-18, 2011
Characterization of the thermal impact of Cu-Cu bonds achieved using TSVs on hot spot dissipation in 3D stacked ICs
H. Oprins
,
V. Cherman
,
B. Vandevelde
,
C. Torregiani
,
M. Stucchi
,
G. Van der Plas
,
P. Marchal
,
E. Beyne
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 861-868, 2011
Modeling Dynamically Reconfigurable Systems for Simulation-Based Functional Verification
Lingkan Gong
,
Oliver Diessel
Conference:
Field-Programmable Custom Computing Machines - FCCM
, pp. 9-16, 2011
Steady state and transient thermal analysis of hot spots in 3D stacked ICs using dedicated test chips
H. Oprins
,
V. Cherman
,
M. Stucchi
,
B. Vandevelde
,
G. Van der Plas
,
P. Marchal
,
E. Beyne
Conference:
Semiconductor Thermal Measurement and Management IEEE Symposium - SEMI-THERM
, pp. 131-137, 2011
Thermal test vehicle for the validation of thermal modelling of hot spot dissipation in 3D stacked ICs
(
Citations: 2
)
H. Oprins
,
V. Cherman
,
C. Torregiani
,
M. Stucchi
,
B. Vandevelde
,
E. Beyne
Conference:
Electronics System-Integration Technology Conference - ESTC
, 2010
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