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Co-authors
(17)
Junji Nakamura
2
Akira Kitamura
2
Hidemi HIRASHIMA
2
Takashi Kouzaki
2
Fumitoshi Kawase
2
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(1)
IWJT
1
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(3)
SURFACE SCI
1
IEEE TRANS SEMICONDUCT MANUF
1
Hyomen Kagaku
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Authors
Akihiko Kitada
Akihiko Kitada,University of Tsukuba,Electrical & Electronic Engineering
Edit
Akihiko Kitada
University of Tsukuba
Publications:
4
|
Citations:
1
Fields:
Electrical & Electronic Engineering
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Collaborated with
17 co-authors
from 2004 to 2010
|
Cited by
9 authors
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Annual
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Publications
(4)
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RefWorks
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Evaluation of Pre-Amorphized Layer Thickness and Interface Quality of High-Dose Shallow Implanted Silicon by Spectroscopic Ellipsometry
(
Citations: 1
)
Satoshi Shibata
,
Fumitoshi Kawase
,
Akihiko Kitada
,
Takashi Kouzaki
,
Akira Kitamura
Journal:
IEEE Transactions on Semiconductor Manufacturing - IEEE TRANS SEMICONDUCT MANUF
, vol. 23, no. 4, pp. 545-552, 2010
Evaluation by spectroscopic ellipsometryof Si amorphized layer thickness after implantation and solid phase re-growth at low annealing temperatures
S. Shibata
,
F. Kawase
,
A. Kitada
,
T. Kouzaki
,
A. Kitamura
,
K. Yamazawa
,
M. Arai
,
Y. Nambu
,
H. Izutani
,
T. Morita
Conference:
International Workshop on Junction Technology - IWJT
, 2010
Three-Ni-atom cluster formed by sulfur adsorption on Ni(1 1 1)
Masamichi Yamada
,
Hidemi Hirashima
,
Akihiko Kitada
,
Ken-ichi Izumi
,
Junji Nakamura
Journal:
Surface Science - SURFACE SCI
, vol. 602, no. 9, pp. 1659-1668, 2008
Step-edges and Catalytic Activity-Dissociation of H2S and CO on Ni(111)-
Akihiko KITADA
,
Hidemi HIRASHIMA
,
Junya OGAWA
,
Haruhisa NAKANO
,
Taketoshi MATSUMOTO
,
Junji NAKAMURA
Journal:
Hyomen Kagaku
, vol. 25, no. 9, pp. 580-585, 2004
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Citations
(1 time by 1 publication)
Evaluation by spectroscopic ellipsometryof Si amorphized layer thickness after implantation and solid phase re-growth at low annealing temperatures
S. Shibata
,
F. Kawase
,
A. Kitada
,
T. Kouzaki
,
A. Kitamura
,
K. Yamazawa
,
M. Arai
,
Y. Nambu
,
H. Izutani
,
T. Morita
Conference:
International Workshop on Junction Technology - IWJT
, 2010
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