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Co-authors
(30)
Leo J. Ernst
12
Hermann Pape
11
Bernhard Wunderle
11
Kaspar M. B. Jansen
8
Angran Xiao
5
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Authors
Gerd Schlottig
Gerd Schlottig,IBM,Engineering
Edit
Gerd Schlottig
IBM
Publications:
17
|
Citations:
28
Fields:
Engineering
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Collaborated with
30 co-authors
from 2005 to 2012
|
Cited by
30 authors
Cumulative
Annual
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Publications
(17)
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RefWorks
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A multivariate parameter analysis of copper pillars eases the design of denser interconnects
Gerd Schlottig
,
Thomas Brunschwiler
,
Javier Goicochea
,
Werner Escher
,
Bruno Michel
Conference:
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE - EuroSimE
, 2012
Delamination toughness of Cu-EMC interfaces at harsh environment
(
Citations: 1
)
M. Sadeghinia
,
K. M. B. Jansen
,
L. J. Ernst
,
G. Schlottig
,
H. Pape
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1976-1980, 2011
Fracture-mechanical interface characterisation for thermo-mechanical co-design — An effcient and comprehensive method for critical mixed-mode data extraction
B. Wunderle
,
M. Schulz
,
J. Keller
,
G. Schlottig
,
I. Maus
,
D. May
,
O. Holck
,
H. Pape
,
B. Michel
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1459-1467, 2011
Fracture toughness of Cu-EMC interfaces under pressure cooker conditions
M. Sadeghinia
,
K. M. B. Jansen
,
L. J. Ernst
,
G. Schlottig
,
H. Pape
Conference:
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE - EuroSimE
, 2011
Establishing the critical fracture properties of the die backside-to-molding compound interface
G. Schlottig
,
H. Pape
,
B. Wunderle
,
L. J. Ernst
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1090-1096, 2011
Sort by:
Citations
(28 times by 13 publications)
Delamination toughness of Cu-EMC interfaces at harsh environment
(
Citations: 1
)
M. Sadeghinia
,
K. M. B. Jansen
,
L. J. Ernst
,
G. Schlottig
,
H. Pape
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1976-1980, 2011
Fracture-mechanical interface characterisation for thermo-mechanical co-design — An effcient and comprehensive method for critical mixed-mode data extraction
B. Wunderle
,
M. Schulz
,
J. Keller
,
G. Schlottig
,
I. Maus
,
D. May
,
O. Holck
,
H. Pape
,
B. Michel
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1459-1467, 2011
Establishing the critical fracture properties of the die backside-to-molding compound interface
G. Schlottig
,
H. Pape
,
B. Wunderle
,
L. J. Ernst
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1090-1096, 2011
Interfacial strength of Silicon-to-Molding Compound changes with thermal residual stress
(
Citations: 1
)
Gerd Schlottig
,
An Xiao
,
Heinz Pape
,
Bernhard Wunderle
,
Leo J. Ernst
Conference:
Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems EuroSimE - EuroSimE
, 2010
Interfacial fracture parameters of silicon-to-molding compound
(
Citations: 2
)
G. Schlottig
,
I. Maus
,
H. Walter
,
K. M. B. Jansen
,
H. Pape
,
B. Wunderle
,
L. J. Ernst
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1939-1945, 2010
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