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D. I. Amey
1
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CDC
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IEEE Transactions on Components, Hybrids, and Manufacturing Technology
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Authors
LEONARD W. SCHAPER
LEONARD W. SCHAPER,Real-Time & Embedded Systems,Manufacturing Technology
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LEONARD W. SCHAPER
Publications:
3
|
Citations:
32
Fields:
Real-Time & Embedded Systems
,
Manufacturing Technology
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Collaborated with
1 co-author
from 1972 to 1992
|
Cited by
75 authors
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Publications
(3)
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Design of multichip modules
(
Citations: 19
)
LEONARD W. SCHAPER
Journal:
Proceedings of The IEEE - PIEEE
, vol. 80, no. 12, pp. 1955-1964, 1992
Improved Electrical Performance Required for Future MOS Packaging
(
Citations: 13
)
LEONARD W. SCHAPER
,
DANIEL I. AMEY
Journal:
IEEE Transactions on Components, Hybrids, and Manufacturing Technology
, vol. 6, no. 3, pp. 283-289, 1983
After urban dynamics: Large scale urban simulation in the second generation
Leonard W. Schaper
Conference:
Conference on Decision and Control - CDC
, 1972
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Citations
(32 times by 32 publications)
A New Method to Reduce the Side-Channel Leakage Caused by Unbalanced Capacitances of Differential Interconnections in Dual-Rail Logic Styles
Jianping Quan
,
Guoqiang Bai
Conference:
International Conference on Information Technology: New Generations - ITNG
, pp. 58-63, 2009
Advanced Photodiode Detector For Medical CT Imaging: Design and Performance
(
Citations: 2
)
Fan Ji
,
Mikko Juntunen
,
Iiro Hietanen
,
Simo Eränen
Published in 2007.
Wafer-Level Integration Technique of Surface Mount Devices on a Si-Wafer With Vibration Energy and Gravity Force
Minoru Sudou
,
Hidekuni Takao
,
Kazuaki Sawada
,
Makoto Ishida
Journal:
IEEE Transactions on Components and Packaging Technologies - IEEE TRANS COMPON PACKAGING T
, vol. 30, no. 3, pp. 457-463, 2007
Thermal management of multi-chip module and printed circuit board using FEM and genetic algorithms
(
Citations: 4
)
K. Jeevan
,
G. A. Quadir
,
K. N. Seetharamu
,
I. A. Azid
Journal:
Microelectronics International - MICROELECTRON INT
, vol. 22, no. 3, pp. 3-15, 2005
Thermal management of multichipmodule (MCM) using genetic algorithms
K. Jeevan
,
K. N. Seetharamu
,
I. A. Ishak
,
G. A. Quadir
Conference:
TENCON, IEEE Region 10 International Conference - TENCON
, 2003
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