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Co-authors
(26)
Kripesh Vaidyanathan
4
Yue Ying Ong
4
Soon Wee Ho
4
David Yeo
4
Dong Kyun Sohn
4
Journals
(1)
Microelectronics Reliability
2
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Authors
Xuefen Ong
Xuefen Ong,Nanyang Technological University,Algorithms & Theory
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Xuefen Ong
Nanyang Technological University
Publications:
4
|
Citations:
5
Fields:
Algorithms & Theory
View FAQ about top research areas and Fields of study
Collaborated with
26 co-authors
from 2008 to 2011
|
Cited by
9 authors
Cumulative
Annual
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Publications
(4)
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Underfill Selection, Characterization, and Reliability Study for Fine-Pitch, Large Die Cu/Low-K Flip Chip Package
Yue Ying Ong
,
Soon Wee Ho
,
Vasarla Nagendra Sekhar
,
Xuefen Ong
,
Jimmy Ong
,
Xiaowu Zhang
,
Kripesh Vaidyanathan
,
Seung Uk Yoon
,
John H. Lau
,
Lim Yeow Kheng
,
David Yeo
,
Kai Chong Chan
http://academic.research.microsoft.com/io.ashx?type=5&id=51179032&selfId1=50616025&selfId2=0&maxNumber=12&query=
Published in 2011.
Design, assembly and reliability of large die and fine-pitch Cu/low-k flip chip package
(
Citations: 1
)
Yue Ying Ong
,
Soon Wee Ho
,
Kripesh Vaidyanathan
,
Vasarla Nagendra Sekhar
,
Ming Chinq Jong
,
Samuel Lim Yak Long
,
Vincent Lee Wen Sheng
,
Leong Ching Wai
,
Vempati Srinivasa Rao
,
Jimmy Ong
,
Xuefen Ong
,
Xiaowu Zhang
http://academic.research.microsoft.com/io.ashx?type=5&id=14000486&selfId1=50616025&selfId2=0&maxNumber=12&query=
Journal:
Microelectronics Reliability
, vol. 50, no. 7, pp. 986-994, 2010
Underfill selection methodology for fine pitch Cu/low-k FCBGA packages
(
Citations: 4
)
Xuefen Ong
,
Soon Wee Ho
,
Yue Ying Ong
,
Leong Ching Wai
,
Kripesh Vaidyanathan
,
Yeow Kheng Lim
,
David Yeo
,
Kai Chong Chan
,
Juan Boon Tan
,
Dong Kyun Sohn
,
Liang Choo Hsia
,
Zhong Chen
Journal:
Microelectronics Reliability
, vol. 49, no. 2, pp. 150-162, 2009
Design, Assembly and Reliability of Large Die (21 x 21mm2) and Fine-pitch (150pm) Cu/Low-K Flip Chip Package
Y. Y. Ong
,
K. Vaidyanathan
,
S. W. Ho
,
V. N. Sekhar
,
M. C. Jong
,
L. C. Wai
,
V. S. Rao
,
V. Sheng
,
J. Ong
,
X. Ong
,
X. Zhang
,
Y. U. Seung
http://academic.research.microsoft.com/io.ashx?type=5&id=50729312&selfId1=50616025&selfId2=0&maxNumber=12&query=
Published in 2008.
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Citations
(5 times by 5 publications)
Impact of usage conditions on solder joint fatigue life
(
Citations: 2
)
Zhen Zhang
,
S B Park
,
Krishna Darbha
,
Raj N. Master
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 14-19, 2010
Evolution and outlook of TSV and 3D IC/Si integration
(
Citations: 1
)
John H. Lau
Published in 2010.
Effect of glass transition slope of underfill on solder joint fatigue life
Zhen Zhang
,
S. B. Park
,
K. Darbha
,
R. N. Master
Conference:
Electronic Packaging Technology, International Conference on - ICEPT
, 2010
Adhesive features of bonded interfaces subjected to temperature shock
Thaiping Chen
Journal:
Journal of The Chinese Institute of Engineers - J CHIN INST ENGINEERS
, vol. 33, no. 6, pp. 935-943, 2010
Dr. Chen, Zhong (陈忠)
É B. Eng
,
É M. Eng
,
É April
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