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Co-authors
(78)
Chau-Jie Zhan
13
Yin-Po Hung
9
Ren-Shin Cheng
9
Tsung-Fu Yang
8
Jing-Yao Chang
8
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Authors
Tao-Chih Chang
Tao-Chih Chang,Industrial Technology Research Institute of Taiwan,Algorithms & Theory,Manufacturing Technology
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Tao-Chih Chang
Industrial Technology Research Institute of Taiwan
Publications:
37
|
Citations:
32
Fields:
Algorithms & Theory
,
Manufacturing Technology
View FAQ about top research areas and Fields of study
Collaborated with
78 co-authors
from 2001 to 2012
|
Cited by
127 authors
Cumulative
Annual
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Publications
(37)
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Reliable Microjoints Formed by Solid–Liquid Interdiffusion (SLID) Bonding Within a Chip-Stacking Architecture
Jing-Yao Chang
,
Ren-Shin Cheng
,
Kuo-Shu Kao
,
Tao-Chih Chang
,
Tung-Han Chuang
Published in 2012.
Failure mechanism of 20 μm pitch microjoint within a chip stacking architecture
(
Citations: 1
)
Shin-Yi Huang
,
Tao-Chih Chang
,
Ren-Shin Cheng
,
Jing-Yao Chang
,
Chia-Wen Fan
,
Chau-Jie Zhan
,
John H. Lau
,
Tai-Hong Chen
,
Wei-Chung Lo
,
Ming-Jer Kao
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 886-892, 2011
Achievement of low temperature chip stacking by a wafer-applied underfill material
Ren-Shin Cheng
,
Kuo-Shu Kao
,
Jing-Yao Chang
,
Yin-Po Hung
,
Tsung-Fu Yang
,
Yu-Wei Huang
,
Su-Mei Chen
,
Tao-Chih Chang
,
Qiaohong Huang
,
Rose Guino
,
Gina Hoang
,
Jie Bai
http://academic.research.microsoft.com/io.ashx?type=5&id=51060855&selfId1=50963345&selfId2=0&maxNumber=12&query=
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1858-1863, 2011
Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration
Ching-Kuan Lee
,
Tao-Chih Chang
,
Yu-Jiau Huang
,
Huan-Chun Fu
,
Jui-Hsiung Huang
,
Zhi-Cheng Hsiao
,
John H. Lau
,
Cheng-Ta Ko
,
Ren-Shin Cheng
,
Pei-Chen Chang
,
Kuo-Shu Kao
,
Yu-Lan Lu
http://academic.research.microsoft.com/io.ashx?type=5&id=51060791&selfId1=50963345&selfId2=0&maxNumber=12&query=
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1468-1474, 2011
Reliable microjoints for chip stacking formed by solid-liquid interdiffusion (SLID) bonding
Tao-Chih Chang
,
Ren-Shin Cheng
,
Kuo-Shu Kao
,
Wei Li
,
Ching-Kuan Lee
,
Jing-Yao Chang
,
Shin-Yi Huang
,
Chia-Wen Fan
,
Yin-Po Hung
,
Yu-Wei Huang
,
Yu-Min Lin
,
Tai-Hong Chen
http://academic.research.microsoft.com/io.ashx?type=5&id=56940336&selfId1=50963345&selfId2=0&maxNumber=12&query=
Conference:
International Microsystems, Packaging, Assembly and Circuits Technology - IMPACT
, pp. 419-422, 2011
Sort by:
Citations
(32 times by 29 publications)
Carbon Nanotubes Based 3-D Matrix for Enabling Three-Dimensional Nano-Magneto-Electronics
Jeongmin Hong
,
Eugenia Stefanescu
,
Ping Liang
,
Nikhil Joshi
,
Song Xue
,
Dmitri Litvinov
,
Sakhrat Khizroev
Journal:
PLOS One
, vol. 7, no. 7, 2012
Achievement of low temperature chip stacking by a wafer-applied underfill material
Ren-Shin Cheng
,
Kuo-Shu Kao
,
Jing-Yao Chang
,
Yin-Po Hung
,
Tsung-Fu Yang
,
Yu-Wei Huang
,
Su-Mei Chen
,
Tao-Chih Chang
,
Qiaohong Huang
,
Rose Guino
,
Gina Hoang
,
Jie Bai
http://academic.research.microsoft.com/io.ashx?type=5&id=51060855&selfId1=50963345&selfId2=0&maxNumber=12&query=
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1858-1863, 2011
Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration
Ching-Kuan Lee
,
Tao-Chih Chang
,
Yu-Jiau Huang
,
Huan-Chun Fu
,
Jui-Hsiung Huang
,
Zhi-Cheng Hsiao
,
John H. Lau
,
Cheng-Ta Ko
,
Ren-Shin Cheng
,
Pei-Chen Chang
,
Kuo-Shu Kao
,
Yu-Lan Lu
http://academic.research.microsoft.com/io.ashx?type=5&id=51060791&selfId1=50963345&selfId2=0&maxNumber=12&query=
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1468-1474, 2011
A model for studying neuropsychological effects of sleep intervention: the effect of three-week continuous positive airway pressure treatment
In-Soo Lee
,
Wayne A. Bardwell
,
Rujvi Kamat
,
Lianne Tomfohr
,
Robert K. Heaton
,
Sonia Ancoli-Israel
,
Jose S. Loredo
,
Joel E. Dimsdale
Journal:
Drug Discovery Today: Disease Models
, vol. 8, no. 4, pp. 147-154, 2011
Development of fluxless chip-on-wafer bonding process for 3DIC chip stacking with 30μm pitch lead-free solder micro bumps and reliability characterization
Chau-Jie Zhan
,
Jing-Ye Juang
,
Yu-Min Lin
,
Yu-Wei Huang
,
Kuo-Shu Kao
,
Tsung-Fu Yang
,
Su-Tsai Lu
,
John H. Lau
,
Tai-Hong Chen
,
Robert Lo
,
M. J. Kao
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 14-21, 2011
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