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Co-authors
(13)
Claude Sarno
4
Mohamed Chaker Zaghdoudi
3
Marta Rencz (Márta Rencz)
1
Johan Liu
1
Bruno Michel
1
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Authors
Christian Tantolin
Christian Tantolin,Hardware & Architecture,Energy
Edit
Christian Tantolin
Publications:
6
|
Citations:
11
Fields:
Hardware & Architecture
,
Energy
View FAQ about top research areas and Fields of study
Collaborated with
13 co-authors
from 1997 to 2011
|
Cited by
46 authors
Cumulative
Annual
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Publications
(6)
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RefWorks
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Use of flat miniature heat pipes for the thermal management of electronic packages
Mohamed Chaker Zaghdoudi
,
Christian Tantolin
,
Claude Sarno
Conference:
International Conference on Microelectronics - ICM
, 2011
Integration, cooling and packaging issues for aerospace equipments
(
Citations: 1
)
Claude Sarno
,
C. Tantolin
Conference:
Design, Automation, and Test in Europe - DATE
, pp. 1225-1230, 2010
Recent progress of thermal interface material research - an overview
(
Citations: 6
)
Johan Liu
,
Bruno Michel
,
Marta Rencz
,
Christian Tantolin
,
Claude Sarno
,
Ralf Miessner
,
Klaus-Volker Schuett
,
X. Tang
,
Sebastien Demoustier
,
Afshin Ziaei
Conference:
International Workshop on Thermal Investigation of ICs and Systems - THERMINIC
, 2008
Use of mini heat pipes for the thermal management of high dissipative electronic packages
M. C. Zaghdoudi
,
S. Maalej
,
C. Tantolin
,
C. Sarno
Conference:
International Conference on Design and Technology of Integrated Systems in Nanoscale Era - DTIS
, 2008
Flat heat pipes thermal performance in body force environment
(
Citations: 2
)
Mohamed Chaker Zaghdoudi
,
Christian Tantolin
,
Claude Godet
Conference:
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - ITHERM
, vol. 2, pp. 114-121 vol. 2, 2000
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Citations
(11 times by 11 publications)
Carbon nanotubes based engineering materials for thermal management applications
Vitaliy Datsyuk
,
Izabela Firkowska
,
Kati Gharagozloo-Hubmann
,
Milana Lisunova
,
Anna-Maria Vogt
,
Andre Boden
,
Maria Kasimir
,
Svitlana Trotsenko
,
Gregor Czempiel
,
Stephanie Reich
Conference:
Semiconductor Thermal Measurement and Management IEEE Symposium - SEMI-THERM
, pp. 325-332, 2011
Revolutionizing heat transport enhancement with liquid metals: Proposal of a new industry of water-free heat exchangers
Haiyan Li
,
Jing Liu
Published in 2011.
Thermal interface materials based on carbon nanotubes and their thermal characterization
M. Kasimir
,
K. Gharagozloo-Hubmann
,
S. Trotsenko
,
G. J. F. Czempiel
,
V. Datsyuk
,
S. Reich
Published in 2010.
Management of thermal interfacial resistance for a reparable thermal interface
Hitoshi Sakamoto
,
Kenichi Inaba
,
Minoru Yoshikawa
Conference:
International Microsystems, Packaging, Assembly and Circuits Technology - IMPACT
, pp. 1-3, 2010
Fillers in insulation for rotating electrical machines
Aleta T. Wilder
,
R. Scott Neves
Journal:
IEEE Transactions on Dielectrics and Electrical Insulation - IEEE TRANS DIELECT ELECTR IN
, vol. 17, no. 5, pp. 1357-1363, 2010
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