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Co-authors
(31)
Sung Kyu Lim
22
Hsien-Hsin S. Lee
9
Michael B. Healy
8
Chinnakrishnan S. Ballapuram
5
Rodric M. Rabbah
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Authors
Mongkol Ekpanyapong
Mongkol Ekpanyapong,Asian Institute of Technology Thailand,Hardware & Architecture,Engineering,Artificial Intelligence
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Mongkol Ekpanyapong
Asian Institute of Technology Thailand
Publications:
33
|
Citations:
140
Fields:
Hardware & Architecture
,
Engineering
,
Artificial Intelligence
View FAQ about top research areas and Fields of study
Collaborated with
31 co-authors
from 2004 to 2012
|
Cited by
210 authors
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Publications
(33)
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Industry trends, learner needs
A. Tavares
,
P. Cardoso
,
J. Mendes
,
J. Monteiro
,
M. Ekpanyapong
,
T. Burrows
Conference:
International Conference on Engineering Education - ICEED
, pp. 1-8, 2012
A FPGA based C runtime hardware accelerator
P. Garcia
,
F. Salgado
,
P. Cardoso
,
J. Cabral
,
M. Ekpanyapong
,
A. Tavares
Conference:
IEEE International Conference on Industrial Informatics - INDIN
, 2011
Fruit detection, tracking, and 3D reconstruction for crop mapping and yield estimation
Jednipat Moonrinta
,
Supawadee Chaivivatrakul
,
Matthew N. Dailey
,
Mongkol Ekpanyapong
Conference:
International Conference on Control, Automation, Robotics and Vision - ICARCV
, pp. 1181-1186, 2010
A comparative analysis of behavioral simulation for third-order cascaded multi-bit Delta-Sigma modulator with interstage feedback paths
Sarayut Amornwongpeeti
,
Mongkol Ekpanyapong
,
Chumnarn Punyasai
Published in 2010.
Multiobjective Microarchitectural Floorplanning for 2-D and 3-D ICs
(
Citations: 32
)
Michael B. Healy
,
Mario Vittes
,
Mongkol Ekpanyapong
,
Chinnakrishnan S. Ballapuram
,
Sung Kyu Lim
,
Hsien-hsin S. Lee
,
Gabriel H. Loh
Journal:
IEEE Transactions on Computer-aided Design of Integrated Circuits and Systems
, vol. 26, no. 1, pp. 38-52, 2007
Sort by:
Citations
(140 times by 119 publications)
Emulation-based transient thermal modeling of 2D/3D systems-on-chip with active cooling
(
Citations: 1
)
Pablo Garcia Del Valle
,
David Atienza
Journal:
Microelectronics Journal
, vol. 42, no. 4, pp. 564-571, 2011
Towards thermally-aware design of 3D MPSoCs with inter-tier cooling
Mohamed M. Sabry
,
Arvind Sridhar
,
David Atienza
,
Yuksel Temiz
,
Yusuf Leblebici
,
Sylwia Szczukiewicz
,
Navid Borhani
,
John R. Thome
,
Thomas Brunschwiler
,
Bruno Michel
Published in 2011.
Energy-Efficient Multiobjective Thermal Control for Liquid-Cooled 3-D Stacked Architectures
Mohamed M. Sabry
,
Ayse K. Coskun
,
David Atienza
,
Tajana Šimunić Rosing
,
Thomas Brunschwiler
Journal:
IEEE Transactions on Computer-aided Design of Integrated Circuits and Systems
, vol. 30, no. 12, pp. 1883-1896, 2011
Hierarchical Thermal Management Policy for High-Performance 3D Systems With Liquid Cooling
Francesco Zanini
,
Mohamed M. Sabry
,
David Atienza
,
Giovanni De Micheli
Journal:
IEEE Journal on Emerging and Selected Topics in Circuits and Systems - JETCAS
, vol. 1, no. 2, pp. 88-101, 2011
Attaining Single-Chip, High-Performance Computing through 3D Systems with Active Cooling
Ayse K. Coskun
,
David Atienza
,
Mohamed Sabry
,
Jie Meng
Journal:
IEEE Micro - MICRO
, vol. 31, no. 4, pp. 63-75, 2011
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