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Co-authors
(37)
Alvin J. Joseph
2
Dawn Wang
2
James S. Dunn
2
Mete Erturk
1
David L. Harame
1
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(2)
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1
ASIC
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(3)
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Authors
John Gillis
John Gillis,IBM,Electrical & Electronic Engineering,Computer Science
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John Gillis
IBM
Publications:
5
|
Citations:
84
Fields:
Electrical & Electronic Engineering
,
Computer Science
View FAQ about top research areas and Fields of study
Collaborated with
37 co-authors
from 2001 to 2011
|
Cited by
315 authors
Cumulative
Annual
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Publications
(5)
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SiGe HBT Power Amplifier design using 0.35 µm BiCMOS technology with through-silicon-via
Jingyang Zhang
,
Dawn Wang
,
Hanyi Ding
,
John Gillis
,
Wan Ni
,
Susan Sweeney
,
Dasheng Fang
Conference:
International Conference on - ASIC
, pp. 1082-1085, 2011
Through-silicon vias enable next-generation SiGe power amplifiers for wireless communications
(
Citations: 9
)
A. J. Joseph
,
J. D. Gillis
,
M. Doherty
,
P. J. Lindgren
,
R. A. Previti-Kelly
,
R. M. Malladi
,
P.-C. Wang
,
M. Erturk
,
H. Ding
,
E. G. Gebreselasie
,
M. J. McPartlin
,
J. Dunn
Journal:
Ibm Journal of Research and Development - IBMRD
, vol. 52, no. 6, pp. 635-648, 2008
1.25 Gbit/s ITU-T G.984.2 burst-mode transimpedance amplifier without reset pins
P. Ossieur
,
T. De Ridder
,
J. Bauwelinck
,
E. De Backer
,
J. Gillis
,
X. Z. Qiu
,
J. Vandewege
Journal:
Electronics Letters - ELECTRON LETT
, vol. 43, no. 18, 2007
Current status and future trends of SiGe BiCMOS technology
(
Citations: 67
)
David L. Harame
,
David C. Ahlgren
,
Douglas D. Coolbaugh
,
James S. Dunn
,
Gregory G. Freeman
,
John D. Gillis
,
Robert A. Groves
,
Gregory N. Hendersen
,
Robb A. Johnson
,
Alvin J. Joseph
,
Seshardi Subbanna
,
Alan M. Victor
http://academic.research.microsoft.com/io.ashx?type=5&id=1440642&selfId1=51774356&selfId2=0&maxNumber=12&query=
Journal:
IEEE Transactions on Electron Devices - IEEE TRANS ELECTRON DEVICES
, vol. 48, no. 11, pp. 2575-2594, 2001
Design and modeling of compact on-chip transformer/balun using multi-level metal windings for RF integrated circuits
(
Citations: 8
)
Tao Liang
,
John Gillis
,
Dawn Wang
,
Paul Cooper
Conference:
Radio Frequency Integrated Circuits IEEE Symposium - RFIC
, pp. 117-120, 2001
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Citations
(84 times by 84 publications)
Interconnect processes and reliability for RF technology
J. P. Gambino
,
F. Anderson
,
E. Cooney
,
J. He
,
R. Bolam
,
B. C. Webb
,
C. Cabral
,
T. Shaw
,
D. Vanslette
Conference:
International Symposium on Physical & Failure Analysis of Integrated Circuits - IPFA
, pp. 1-11, 2011
Co-Optimization and Analysis of Signal, Power, and Thermal Interconnects in 3-D ICs
Young-Joon Lee
,
Sung Kyu Lim
Journal:
IEEE Transactions on Computer-aided Design of Integrated Circuits and Systems
, vol. 30, no. 11, pp. 1635-1648, 2011
Impact of the collector region fabrication on electrical characteristics of HCBT structures in 180 nm BiCMOS technology
M. Koricic
,
T. Suligoj
,
H. Mochizuki
,
S. Morita
,
K. Shinomura
,
H. Imai
Published in 2011.
Electromigration performance of Through Silicon Via (TSV) - A modeling approach
(
Citations: 2
)
Y. C. Tan
,
Cher Ming Tan
,
Xiaowu Zhang
,
Tai Chong Chai
,
D. Q. Yu
Journal:
Microelectronics Reliability
, vol. 50, no. 9-11, pp. 1336-1340, 2010
An industrial perspective of 3D IC integration technology: from the viewpoint of design technology
(
Citations: 2
)
Kyu-Myung Choi
Conference:
Asia and South Pacific Design Automation Conference - ASP-DAC
, pp. 544-545, 2010
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