Sign in
Author
|
Conference
|
Journal
|
Organization
|
Year
|
DOI
Look for results that meet for the following criteria:
since
equal to
before
between
and
Search in all fields of study
Limit my searches in the following fields of study
Agriculture Science
Arts & Humanities
Biology
Chemistry
Computer Science
Economics & Business
Engineering
Environmental Sciences
Geosciences
Material Science
Mathematics
Medicine
Physics
Social Science
Multidisciplinary
Co-authors
(278)
Alfred Grill
9
Eric G. Liniger
8
Axel Simon
6
Eva E. Simonyi
6
Larry A. Clevenger
6
Conferences
(3)
IITC
6
IEDM
3
IRPS
2
Journals
(2)
Thin Solid Films
3
MICROELECTRON ENG
1
Keywords
(44)
Embed
Subscribe
Academic
Authors
D. D Restaino
D. D Restaino,IBM,Mechanical Engineering,Electrical & Electronic Engineering,Nanotechnology
Edit
D. D Restaino
IBM
Publications:
15
|
Citations:
85
Fields:
Mechanical Engineering
,
Electrical & Electronic Engineering
,
Nanotechnology
View FAQ about top research areas and Fields of study
Collaborated with
278 co-authors
from 1992 to 2011
|
Cited by
416 authors
Cumulative
Annual
Sort by:
Publications
(15)
BibTeX
|
RIS
|
RefWorks
Download
Optimization of porous ultra low-κ dielectrics (κ ≤ 2.55) for 28nm generation
D. Kioussis
,
E. T. Ryan
,
A. Madan
,
N. Klymko
,
S. Molis
,
Z. Sun
,
H. Masuda
,
S. Liang
,
T. Lee
,
D. Restaino
,
L. Clevenger
,
R. Quon
http://academic.research.microsoft.com/io.ashx?type=5&id=51067795&selfId1=51989398&selfId2=0&maxNumber=12&query=
Conference:
Interconnect Technology, IEEE International Conference - IITC
, pp. 1-3, 2011
Development and optimization of porous pSiCOH interconnect dielectrics for 45 nm and beyond
(
Citations: 1
)
A. Grill
,
S. Gates
,
C. Dimitrakopoulos
,
V. Patel
,
S. Cohen
,
Y. Ostrovski
,
E. Liniger
,
E. Simonyi
,
D. Restaino
,
S. Sankaran
,
S. Reiter
,
A. Demos
http://academic.research.microsoft.com/io.ashx?type=5&id=50656232&selfId1=51989398&selfId2=0&maxNumber=12&query=
Conference:
Interconnect Technology, IEEE International Conference - IITC
, 2008
High Performance 45-nm SOI Technology with Enhanced Strain, Porous Low-k BEOL, and Immersion Lithography
(
Citations: 39
)
S. Narasimha
,
K. Onishi
,
H. M. Nayfeh
,
A. Waite
,
M. Weybright
,
J. Johnson
,
C. Fonseca
,
D. Corliss
,
C. Robinson
,
M. Crouse
,
D. Yang
,
C.-H. J. Wu
D. Restaino
http://academic.research.microsoft.com/io.ashx?type=5&id=50540015&selfId1=51989398&selfId2=0&maxNumber=12&query=
Conference:
International Electron Devices Meeting - IEDM
, 2006
Electromigration Cu mass flow in Cu interconnections
(
Citations: 10
)
C.-K. Hu
,
D. Canaperi
,
S. T. Chen
,
L. M. Gignac
,
S. Kaldor
,
M. Krishnan
,
S. G. Malhotra
,
E. Liniger
,
J. R. Lloyd
,
D. L. Rath
,
D. Restaino
,
R. Rosenberg
http://academic.research.microsoft.com/io.ashx?type=5&id=40639162&selfId1=51989398&selfId2=0&maxNumber=12&query=
Journal:
Thin Solid Films
, vol. 504, no. 1, pp. 274-278, 2006
A 45 nm CMOS node Cu/Low-k/ Ultra Low-k PECVD SiCOH (k=2.4) BEOL Technology
(
Citations: 6
)
S. Sankaran
,
S. Arai
,
R. Augur
,
M. Beck
,
G. Biery
,
T. Bolom
,
G. Bonilla
,
O. Bravo
,
K. Chanda
,
M. Chae
,
F. Chen
,
L. Clevenger
D. Restaino
http://academic.research.microsoft.com/io.ashx?type=5&id=50539938&selfId1=51989398&selfId2=0&maxNumber=12&query=
Conference:
International Electron Devices Meeting - IEDM
, 2006
Sort by:
Citations
(85 times by 79 publications)
Effects of side reservoirs on the electromigration lifetime of copper interconnects
Hendro Mario
,
Chee Lip Gan
,
Yeow Kheng Lim
,
Juan Boon Tan
,
Jun Wei
,
Tongjai Chookajorn
,
Carl V. Thompson
Conference:
International Symposium on Physical & Failure Analysis of Integrated Circuits - IPFA
, pp. 1-4, 2011
Front-end-of-line quadrature-clocked voltage-dependent capacitance measurement
Stas Polonsky
,
Paul Solomon
,
Jiun-hsin Liao
,
Lou Medina
,
Mark Ketchen
Conference:
IEEE International Conference on Microelectronic Test Structures - ICMTS
, pp. 4-7, 2011
45nm Yield model optimization
Brian L. Walsh
,
John Colt
,
Daniel Poindexter
,
Thomas Joseph
Conference:
Advanced Semiconductor Manufacturing, IEEE/SEMI Conference and Workshop - ASMC
, pp. 1-4, 2011
Impact of Source/Drain contact and gate finger spacing on the RF reliability of 45-nm RF nMOSFETs
Rajan Arora
,
Sachin Seth
,
John Chung Hang Poh
,
John D. Cressler
,
Akil K. Sutton
,
Hasan M. Nayfeh
,
Giuseppe L. Rosa
,
Greg Freeman
Published in 2011.
The state-of-the-art in semiconductor reverse engineering
Randy Torrance
,
Dick James
Published in 2011.
Comments