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Co-authors
(43)
Stephane Moreau (Stéphane Moreau)
3
Lorena Anghel
2
Rachid Taibi
2
Jerome Dechamp
2
Lucile Arnaud
2
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IEEE J SOLID-STATE CIRCUITS
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Authors
Cedrick Chappaz
Cedrick Chappaz,École Nationale Supérieure des Mines de Saint Étienne,Electrical & Electronic Engineering
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Cedrick Chappaz
École Nationale Supérieure des Mines de Saint Étienne
Publications:
8
|
Citations:
7
Fields:
Electrical & Electronic Engineering
View FAQ about top research areas and Fields of study
Collaborated with
43 co-authors
from 2003 to 2011
|
Cited by
39 authors
Cumulative
Annual
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Publications
(8)
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Investigation of stress induced voiding and electromigration phenomena on direct copper bonding interconnects for 3D integration
R. Taibi
,
L. Di Cioccio
,
C. Chappaz
,
M. Francou
,
J. Dechamp
,
P. Larre
,
S. Moreau
,
L. L. Chapelon
,
R. Fortunier
Conference:
International Electron Devices Meeting - IEDM
, pp. 6.5.1-6.5.4, 2011
Resistance increase due to electromigration induced depletion under TSV
T. Frank
,
C. Chappaz
,
P. Leduc
,
L. Arnaud
,
F. Lorut
,
S. Moreau
,
A. Thuaire
,
R. El Farhane
,
L. Anghel
Published in 2011.
Full characterization of Cu/Cu direct bonding for 3D integration
(
Citations: 5
)
Rachid Taibi
,
Lea Di Cioccio
,
Cedrick Chappaz
,
Laurent-Luc Chapelon
,
Pierric Gueguen
,
Jerome Dechamp
,
Roland Fortunier
,
Laurent Clavelier
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 219-225, 2010
Reliability approach of high density Through Silicon Via (TSV)
(
Citations: 1
)
Thomas FRANK
,
Cédrick CHAPPAZ
,
Patrick LEDUC
,
Lucile ARNAUD
,
Stéphane MOREAU
,
Aurélie THUAIRE
,
Rebha EL FARHANE
,
Lorena ANGHEL
Published in 2010.
Self heating under RF power in BAW SMR and its predictive 1D thermal model
(
Citations: 1
)
N. B. Hassine
,
D. Mercier
,
P. Renaux
,
D. Bloch
,
G. Parat
,
B. Ivira
,
P. Waltz
,
C. Chappaz
,
R. Fillit
,
S. Basrour
Conference:
IEEE International Frequency Control Symposium - FCS
, pp. 237-240, 2009
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Citations
(7 times by 7 publications)
Electrical characterization and impact on signal integrity of new basic interconnection elements inside 3D integrated circuits
J. Roullard
,
S. Capraro
,
A. Farcy
,
T. Lacrevaz
,
C. Bermond
,
P. Leduc
,
J. Charbonnier
,
C. Ferrandon
,
C. Fuchs
,
B. Flechet
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1176-1182, 2011
Resistance increase due to electromigration induced depletion under TSV
T. Frank
,
C. Chappaz
,
P. Leduc
,
L. Arnaud
,
F. Lorut
,
S. Moreau
,
A. Thuaire
,
R. El Farhane
,
L. Anghel
Published in 2011.
Copper direct bonding: An innovative 3D interconnect
(
Citations: 4
)
Pierric Gueguen
,
Lea Di Cioccio
,
Panagiota Morfouli
,
Marc Zussy
,
Jerome Dechamp
,
Laurent Bally
,
Laurent Clavelier
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 878-883, 2010
Third-order intermodulation distortion due to self-heating in gold coplanar waveguides
(
Citations: 2
)
Eduard Rocas
,
Carlos Collado
,
N. Orloff
,
James C. Booth
Conference:
Microwave, MTT-S International Symposium - MTT
, pp. 425-428, 2010
Recent developments of Cu-Cu non-thermo compression bonding for wafer-to-wafer 3D stacking
I. Radu
,
D. Landru
,
G. Gaudin
,
G. Riou
,
C. Tempesta
,
F. Letertre
,
L. Di Cioccio
,
P. Gueguen
,
T. Signamarcheix
,
C. Euvrard
,
J. Dechamp
,
L. Clavelier
http://academic.research.microsoft.com/io.ashx?type=5&id=51030522&selfId1=52245917&selfId2=0&maxNumber=12&query=
Conference:
IEEE International Conference on 3D System Integration - 3DIC
, 2010
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