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Co-authors
(26)
Scott Shaobing Chen
2
John H. Lau
2
Vaidyanathan Kripesh
2
Soon Wee Ho
2
Chih-Ming Huang
2
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(1)
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Academic
Authors
Jong Ming Ching
Jong Ming Ching,Engineering
Edit
Jong Ming Ching
Publications:
2
|
Citations:
21
Fields:
Engineering
View FAQ about top research areas and Fields of study
Collaborated with
26 co-authors
from 2008 to 2009
|
Cited by
67 authors
Cumulative
Annual
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Publications
(2)
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RefWorks
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Three dimensional interconnects with high aspect ratio TSVs and fine pitch solder microbumps
(
Citations: 11
)
Aibin Yu
,
John H Lau
,
Soon Wee Ho
,
A. Kumar
,
Hnin Wai Yin
,
Jong Ming Ching
,
V. Kripesh
,
D. Pinjala
,
S. Chen
,
Chien-Feng Chan
,
Chun-Chieh Chao
,
Chi-Hsin Chiu
http://academic.research.microsoft.com/io.ashx?type=5&id=6894467&selfId1=55928698&selfId2=0&maxNumber=12&query=
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 350-354, 2009
Development of Fine Pitch Solder Microbumps for 3D Chip Stacking
(
Citations: 10
)
Aibin Yu
,
Aditya Kumar
,
Soon Wee Ho
,
Hnin Wai Yin
,
J. H. Lau
,
Khong Chee Houe
,
S. Lim Pei Siang
,
Xiaowu Zhang
,
Da-Quan Yu
,
Nandar Su
,
M. Chew Bi-Rong
,
Jong Ming Ching
http://academic.research.microsoft.com/io.ashx?type=5&id=50729276&selfId1=55928698&selfId2=0&maxNumber=12&query=
Published in 2008.
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Citations
(21 times by 16 publications)
Characterization and reliability assessment of solder microbumps and assembly for 3D IC integration
Ching-Kuan Lee
,
Tao-Chih Chang
,
Yu-Jiau Huang
,
Huan-Chun Fu
,
Jui-Hsiung Huang
,
Zhi-Cheng Hsiao
,
John H. Lau
,
Cheng-Ta Ko
,
Ren-Shin Cheng
,
Pei-Chen Chang
,
Kuo-Shu Kao
,
Yu-Lan Lu
http://academic.research.microsoft.com/io.ashx?type=5&id=51060791&selfId1=55928698&selfId2=0&maxNumber=12&query=
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1468-1474, 2011
Fabrication of High Aspect Ratio TSV and Assembly With Fine-Pitch Low-Cost Solder Microbump for Si Interposer Technology With High-Density Interconnects
Aibin Yu
,
John H. Lau
,
Soon Wee Ho
,
Aditya Kumar
,
Wai Yin Hnin
,
Wen Sheng Lee
,
Ming Ching Jong
,
Vasarla Nagendra Sekhar
,
Vaidyanathan Kripesh
,
Damaruganath Pinjala
,
Scott Chen
,
Chien-Feng Chan
http://academic.research.microsoft.com/io.ashx?type=5&id=51190768&selfId1=55928698&selfId2=0&maxNumber=12&query=
Published in 2011.
Electromigration in Ni/Sn intermetallic micro bump joint for 3D IC chip stacking
Yu-Min Lin
,
Chau-Jie Zhan
,
Jing-Ye Juang
,
John H. Lau
,
Tai-Hong Chen
,
Robert Lo
,
M. Kao
,
Tian Tian
,
King-Ning Tu
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 351-357, 2011
Achieving Stable Through-Silicon Via (TSV) Capacitance with Oxide Fixed Charge
L. Zhang
,
H. Y. Li
,
S. Gao
,
C. S. Tan
Journal:
IEEE Electron Device Letters - IEEE ELECTRON DEV LETT
, vol. 32, no. 5, pp. 668-670, 2011
Design and fabrication of a reliability test chip for 3D-TSV
(
Citations: 10
)
A D Trigg
,
Li Hong Yu
,
Xiaowu Zhang
,
Chai Tai Chong
,
Cheng Cheng Kuo
,
Navas Khan
,
Yu Daquan
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 79-83, 2010
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