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Co-authors
(21)
Yogendra K. Joshi
7
William P. King
6
K. Ramakrishna
5
Darvin R. Edwards
3
Jie-Hua Zhao
2
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Authors
Siva P. Gurrum
Siva P. Gurrum,Texas Instruments, Inc.,Energy,Aeronautics & Aerospace Engineering,Electrical & Electronic Engineering
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Siva P. Gurrum
Texas Instruments, Inc.
Publications:
14
|
Citations:
26
Fields:
Energy
,
Aeronautics & Aerospace Engineering
,
Electrical & Electronic Engineering
View FAQ about top research areas and Fields of study
Collaborated with
21 co-authors
from 2002 to 2011
|
Cited by
89 authors
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Annual
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Publications
(14)
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Delamination prediction in lead frame packages using adhesion measurements and interfacial fracture modeling
Venkat Srinivasan
,
Mikel Miller
,
Siva Gurrum
,
Jie-Hua Zhao
,
Darvin Edwards
,
Masood Murtuza
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1269-1275, 2011
A quick PCB thermal calculator to aid system design of exposed pad packages
Siva P. Gurrum
,
Matthew D. Romig
,
Sandra J. Horton
,
Darvin R. Edwards
Conference:
Semiconductor Thermal Measurement and Management IEEE Symposium - SEMI-THERM
, pp. 63-69, 2011
Packaging optimization to mitigate stress induced parameter shift in precision devices
Jie-Hua Zhao
,
Siva Gurrum
,
Darvin Edwards
Conference:
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems - ITHERM
, pp. 1-8, 2010
A multiscale modeling and experimental study of underfill flow and void formation for flip-chip packages
(
Citations: 2
)
Siyi Zhou
,
Ying Sun
,
Jeremias Libres
,
Siva Gurrum
,
Patrick Thompson
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 2004-2010, 2009
A coaxial probe system for measuring Z-direction electrical resistivity of conductive polymers
Siva P. Gurrum
,
Rajiv Dunne
,
Michael Lamson
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 1643-1647, 2009
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Citations
(26 times by 23 publications)
Generalized Heat Transition Matrix for Arbitrarily Shaped Thermal Media and Its Applications to Steady-State Heat Conduction Problems in Large-Scale Systems
(
Citations: 1
)
Gaobiao Xiao
,
Luo Zhang
,
Yue Zhou
Journal:
Numerical Heat Transfer Part B-fundamentals - NUMER HEAT TRANSFER PT B-FUND
, vol. 59, no. 4, pp. 319-338, 2011
Nanoscale Joule heating, Peltier cooling and current crowding at graphene-metal contacts
(
Citations: 2
)
Kyle L. Grosse
,
Myung-Ho Bae
,
Feifei Lian
,
Eric Pop
,
William P. King
Journal:
Nature Nanotechnology - NAT NANOTECHNOL
, vol. 6, no. 5, pp. 287-290, 2011
Literature Survey of Numerical Heat Transfer (2000–2009): Part II
(
Citations: 1
)
Tien-Mo Shih
,
Martinus Arie
,
Derrick Ko
Journal:
Numerical Heat Transfer Part A-applications - NUMER HEAT TRANSFER PT A-APPL
, vol. 60, no. 11-12, pp. 883-1096, 2011
Thin-core MCM assembly development for high-performance server microprocessor
Sean S. Too
,
Mohammad Khan
,
Kevin Lim
,
Mike Loo
,
W C Lau
,
Azlina Nayan
,
S F Ng
,
B L Peh
,
Edwin Goh
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 517-522, 2011
Processing and reliability analysis of flip-chips with solder bumps down to 30 μm diameter
Jorg Franke
,
Rainer Dohle
,
Florian Schusler
,
Thomas Oppert
,
Thomas Friedrich
,
Stefan Harter
Conference:
Electronic Components and Technology Conference - ECTC
, pp. 893-900, 2011
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