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Utilizing a low cost 3D packaging technology for consumer applications

Utilizing a low cost 3D packaging technology for consumer applications,10.1109/30.477228,IEEE Transactions on Consumer Electronics,Steven P. Larcombe,

Utilizing a low cost 3D packaging technology for consumer applications  
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This paper demonstrates how a low cost three-dimensional packaging (multichip module-vertical) technology can be utilized to implement systems for consumer applications. In any application where system cost, volume and mass are important, this packaging technique can be advantageous, particularly in the rapidly growing portable electronics industry. To illustrate this we present a general-purpose, low-cost camera and image processing system in the new packaging technology. This can be used in multimedia, surveillance and smart vision applications
Journal: IEEE Transactions on Consumer Electronics - IEEE TRANS CONSUM ELECTRON , vol. 41, no. 4, pp. 1095-1102, 1995
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