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Contrasting single-wafer and batch processing for memory devices

Contrasting single-wafer and batch processing for memory devices,10.1109/TSM.2003.810939,IEEE Transactions on Semiconductor Manufacturing,Ronald A. We

Contrasting single-wafer and batch processing for memory devices  
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Single-wafer technology has been shown to improve memory device performance and ultimately improve product yield for several front-end-of-line (FEOL) processes. Single-wafer processes that are reviewed include silicon nitride for word-line cap, flash oxide-nitride-oxide dielectric, cell dielectric re-oxidation, and selective oxidation.
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