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Mechanical Property
Microstructures
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Variation of Mechanical Property and Microstructure across Sn Solder Joint in Cu/Sn/Ni Structure
Variation of Mechanical Property and Microstructure across Sn Solder Joint in Cu/Sn/Ni Structure,10.1149/1.3447865,Electrochemical and Solid State Let
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Variation of Mechanical Property and Microstructure across Sn Solder Joint in Cu/Sn/Ni Structure
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C. Y. Liu
,
H. W. Tseng
,
J. M. Song
Journal:
Electrochemical and Solid State Letters - ELECTROCHEM SOLID STATE LETT
, vol. 13, no. 9, 2010
DOI:
10.1149/1.3447865
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References
(11)
Six cases of reliability study of Pb-free solder joints in electronic packaging technology
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Cross interactions on interfacial compound formation of solder bumps and metallization layers during reflow
(
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T. L. Shao
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Y. M. Huang
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Chih Chen
Journal:
Journal of Materials Research - J MATER RES
, vol. 19, no. 12, pp. 3654-3664, 2004
Asymmetrical solder microstructure in Ni/Sn/Cu solder joint
(
Citations: 7
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S. J. Wang
,
C. Y. Liu
Journal:
Scripta Materialia - SCRIPTA MATER
, vol. 55, no. 4, pp. 347-350, 2006
Controlling Ag 3 Sn plate formation in near-ternary-eutectic Sn-Ag-Cu solder by minor Zn alloying
(
Citations: 30
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Sung K. Kang
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Da-Yuan Shih
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Donovan Leonard
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Donald W. Henderson
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Timothy Gosselin
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Sung-Il Cho
,
Jin Yu
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Won K. Choi
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Jom
, vol. 56, no. 6, pp. 34-38, 2004
Kinetic analysis of the interfacial reactions in Ni/Sn/Cu sandwich structures
(
Citations: 4
)
S. J. Wang
,
C. Y. Liu
Journal:
Journal of Electronic Materials - J ELECTRON MATER
, vol. 35, no. 11, pp. 1955-1960, 2006