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Modeling of the effective thermal conductivity of composite materials with FEM based on resistor networks approach

Modeling of the effective thermal conductivity of composite materials with FEM based on resistor networks approach,10.1007/s00542-009-0984-1,Microsyst

Modeling of the effective thermal conductivity of composite materials with FEM based on resistor networks approach   (Citations: 4)
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In the present paper, a novel and efficient model was developed for predicting the effective thermal conductivity of the composite materials at different filler percentages. By introducing the relative radius as a parameter, the effective thermal conductivity can be predicted precisely when the thermal properties of filler and matrix are prescribed. The model employed the resistor network strategy to achieve a highly efficient prediction during the overall conductivity calculation. To verify this model, a wide range of two-phase composites, including Cu/PP, AlN/PI and a self-developed thermal conductive adhesive, were analyzed. The model-based simulation values showed good agreement with the experimental results. Moreover, a discussion on the effects of the newly-introduced parameter was given. Finally, the relationship between the filler radius variation and the thermal conductivity of the composite was studied.
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    • ...coefficient in the effective thermal conductivity prediction, the contact situation can be taken into consideration during the model setup, cf. Yue et al. (2010)...

    Yan Zhanget al. Study on the bimodal filler influence on the effective thermal conduct...

    • ...Several studies reveal that instead of heat conductance through epoxy, the main factor influencing thermal conductivity of TCA is the contact between filler particles [6- 9]. During the curing process, the epoxy shrank and compressed the filler particles tightly, and then a network composed of many conductive paths was formed in the TIM [9]...
    • ...Several studies reveal that instead of heat conductance through epoxy, the main factor influencing thermal conductivity of TCA is the contact between filler particles [6- 9]. During the curing process, the epoxy shrank and compressed the filler particles tightly, and then a network composed of many conductive paths was formed in the TIM [9]...
    • ...However it was impossible to make a direct calculation due to the unaffordable computational cost [9]...

    Zhili Huet al. The effect of modulus on the performance of thermal conductive adhesiv...

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