Academic
Publications
Viscoelastic Warpage Analysis of Surface Mount Package

Viscoelastic Warpage Analysis of Surface Mount Package,10.1115/1.1339820,Journal of Electronic Packaging,Kiyoshi Miyake,Tsukasa Yoshida,Hyung Gil Baik

Viscoelastic Warpage Analysis of Surface Mount Package   (Citations: 16)
BibTex | RIS | RefWorks Download
Cumulative Annual
View Publication
The following links allow you to view full publications. These links are maintained by other sources not affiliated with Microsoft Academic Search.
Sort by: