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Keywords
(9)
Analytic Solution
Analytical Method
Boundary Condition
Diffusion Coefficient
Diffusion Equation
Intermetallic Compound
Kinetics
Solid Solution
Growth Rate
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Analysis of kinetics of reactive diffusion in a hypothetical binary system
Analysis of kinetics of reactive diffusion in a hypothetical binary system,10.1016/j.actamat.2003.10.047,Acta Materialia,M Kajihara
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Analysis of kinetics of reactive diffusion in a hypothetical binary system
(
Citations: 20
)
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M Kajihara
A hypothetical binary system composed of one
intermetallic compound
and two primary
solid solution
phases was considered in order to analyze the
kinetics
of reactive diffusion theoretically. Assuming that the migration of the interface is controlled by the volume diffusion in the neighboring phases, the
growth rate
of the
intermetallic compound
due to the reactive diffusion between the primary
solid solution
phases in a semiinfinite diffusion couple at an appropriate annealing temperature was evaluated using an analytical solution of diffusion equations. The assumption deduces the parabolic relationship. According to the parabolic relationship, the square of the thickness of the
intermetallic compound
increases in proportion to the annealing time. The evaluation indicates that the most predominant parameters controlling the
growth rate
are the
diffusion coefficient
and the solubility range of the intermetallic compound. A change of the
diffusion coefficient
by five orders of magnitude results in variations of the proportionality coefficient of the parabolic relationship by seven–eight orders of magnitude under the present initial and boundary conditions. The effect of the solubility range on the
growth rate
is comparable to that of the
diffusion coefficient
on the growth rate. Consequently, for a line compound with a small diffusion coefficient, it will take a long time to grow up to an observable thickness.
Journal:
Acta Materialia  ACTA MATER
, vol. 52, no. 5, pp. 11931200, 2004
DOI:
10.1016/j.actamat.2003.10.047
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Citation Context
(2)
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7
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Formation and growth kinetics of intermediate phases in NiAl diffusion...
...Ni and Ni3Nb solid phase (Fig.14) near Ni solid phase, the general error function solution is written as [
19
] :...
Shiquan Zhou
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et al.
Interfacial microstructure and properties of Ti(C, N)/Ni bonded by tra...
References
(1)
Numerical Methods
(
Citations: 760
)
Germund Dahlquist
,
Ake Bjorck
,
Ned Anderson
Journal:
Mathematics of Computation  Math. Comput.
, vol. 29, no. 130, 1975
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Citations
(20)
Corrosion Mechanisms of Steel and Cast Iron by Molten Aluminum
David Balloy
,
JeanCharles Tissier
,
MarieLaurence Giorgi
,
Marc Briant
Journal:
Metallurgical and Materials Transactions Aphysical Metallurgy and Materials Science  METALL MATER TRANS A
, vol. 41, no. 9, pp. 23662376, 2010
EARLY INTERFACIAL REACTION AND UNDERCOOLING SOLIDIFICATION BEHAVIOR OF Sn3.5Ag/Cu SYSTEM: EARLY INTERFACIAL REACTION AND UNDERCOOLING SOLIDIFICATION BEHAVIOR OF Sn3.5Ag/Cu SYSTEM
Minbo ZHOU
,
Xunping LI
,
Xiao MA
,
Xinping ZHANG
Journal:
Acta Metallurgica Sinica  ACTA METALL SIN
, vol. 46, no. 5, pp. 569574, 2010
Kinetics of reactive diffusion between Ta and Cu–9.3Sn–0.3Ti alloy
Y. Tejima
,
S. Nakamura
,
M. Kajihara
Journal:
Journal of Materials Science  J MATER SCI
, vol. 45, no. 4, pp. 919928, 2010
Kinetics of isothermal reactive diffusion between solid Fe and liquid Al
Y. Tanaka
,
M. Kajihara
Journal:
Journal of Materials Science  J MATER SCI
, vol. 45, no. 20, pp. 56765684, 2010
Analysis for Kinetics of Austenite Growth due to Isothermal Carburization of Ferrite
Masanori Kajihara
Journal:
Materials Transactions  MATER TRANS
, vol. 51, no. 7, pp. 12421248, 2010