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Diffusion Parameters and Growth Mechanism of Phases in the Cu-Sn System

Diffusion Parameters and Growth Mechanism of Phases in the Cu-Sn System,10.1007/s11661-010-0592-9,Metallurgical and Materials Transactions A-physical

Diffusion Parameters and Growth Mechanism of Phases in the Cu-Sn System   (Citations: 2)
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The tracer diffusion coefficients of the elements as well as the integrated interdiffusion coefficients are determined for the Cu3Sn and Cu6Sn5 intermetallic compounds using incremental diffusion couples and Kirkendall marker shift measurements. The activation energies are determined for the former between 498 K and 623 K (225 °C and 350 °C) and for the latter between 423 K and 473 K (150 °C and 200 °C). Sn is found to be a slightly faster diffuser in Cu6Sn5, and Cu is found to be the faster diffuser in Cu3Sn. The results from the incremental couples are used to predict the behavior of a Cu/Sn couple where simultaneous growth of both intermetallics occurs. The waviness at the Cu3Sn/Cu6Sn5 interface and possible reasons for not finding Kirkendall markers in both intermetallics in the Cu/Sn couple are discussed.
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    • ...From our calculations, it is found that Cu is around 32 times faster than Sn through the Cu3Sn phase [14], whereas Si is around 35 times faster than Co in the CoSi phase [6]...

    A. Paul. Growth mechanism of phases, Kirkendall voids, marker plane position, a...

    • ...Recently, Paul and coworkers [15,16] studied the Kirkendall effect in the Cu-Sn system using multiphase solid-solid diffusion couples assembled at 215 C; he reported on the kinetics and morphological aspects of IMC growth in the Cu-Sn system, but did not provide any insight into the microvoids formed at the Cu-Cu3Sn interface and in the Cu3Sn layer...
    • ...m ¼ 10: 6c m 3 =mol. [16,18] Hence, the total decrease in...
    • ...m ¼ 10: 6c m 3 =mol, respectively and were calculated from lattice parameters reported by Paul and coworkers [16,18] For analysis of the concentration profiles by the method of Guy et al., [28] the partial molar volume of each diffusing component is assumed constant throughout the diffusion zone and was calculated from the molar volumes of Cu3Sn and Cu6Sn5...
    • ...Paul et al. [16] have recently reported that Sn has a higher...
    • ...[16] They reported high variations in their calculated integrated diffusion coefficients (up to 60%) due to the development of non-planar interfaces and variation in the position of the marker plane in the Cu/Sn diffusion couples, similar to those presented in this study...
    • ...The calculated diffusivity data for both phases (Cu3Sn and Cu6Sn5) are summarized in Table 2. To the best of our knowledge, the intrinsic diffusion coefficients of Cu and Sn for the Cu3Sn phase determined in this study are the first reported values at 200 C. Paul et al. [16] have recently reported the tracer diffusion coefficients of Cu and Sn in Cu3Sn phase at 200 C based on the extrapolation of their results at higher temperatures, ...
    • ...Onishi and Fujibuchi [14] Paul et al. [16] This work (based on average values)...

    Santosh Kumaret al. Intrinsic and Interdiffusion in Cu-Sn System

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