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Flip-chip package with a heat spreader for high power dissipation LSI chips

Flip-chip package with a heat spreader for high power dissipation LSI chips,10.1109/ECTC.1999.776176,H. Ando,H. Kikuchi,T. Sato

Flip-chip package with a heat spreader for high power dissipation LSI chips  
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Today's LSIs consume more power than their predecessors, so packages are required to cool them effectively. To make a package with a thermal resistance of less than 1 K/W, we developed a flip-chip C-BGA (ceramic-ball grid array) package with a large heat spreader soldered to the back of the flip-chip. Key fabrication techniques are to dispense resin after attaching the heat spreader, controlling the amount of resin dispensed, and forming an organic layer on the chip surface. In a heat cycle test, the package lifetime exceeded 1000 cycles. We also formed support balls to prevent the BGA-balls from collapsing under the heavy weight of the package
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