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A hybrid Silicon-On-Glass (SOG) lateral micro-accelerometer with CMOS readout circuitry

A hybrid Silicon-On-Glass (SOG) lateral micro-accelerometer with CMOS readout circuitry,10.1109/MEMSYS.2002.984348,Junseok Chae,Haluk Kulah,Khalil Naj

A hybrid Silicon-On-Glass (SOG) lateral micro-accelerometer with CMOS readout circuitry   (Citations: 16)
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A hybrid micro-accelerometer system consisting of a new bulk Silicon-On-Glass (SOG) lateral capacitive micro-accelerometer and a CMOS interface circuit is presented. The accelerometer has a 120 μm-thick proof mass, 2.2 mm × 3.0 mm in size with a 3.2 μm sensing gap defined by DRIE. The circuit has a 95 dB dynamic range, a low offset of 370 μV and can resolve better than 75 aF. The hybrid system has a measured sensitivity of 40 mV/g and resolution of 100 μg/√(Hz)
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    • ...However, recently a number of other thick structural layer processes, such as silicon-on-glass (SOG) [12], [13], and silicon-on-insulator (SOI) processes [14]‐[16], have been developed mostly for high performance inertial and resonant sensors, where their wafer-level vacuum packaging is essential for reducing the cost of the final products...
    • ...3000 -thick Al layer is evaporated on 100 -thick silicon wafer and patterned as the shield metallization in order to avoidion damaging and overheating problems during DRIE of the silicon wafer [Fig. 5(b)(iii) and (b)(iv)] [12]...

    Ebru Sagiroglu Topalliet al. Pirani Vacuum Gauges Using Silicon-on-Glass and Dissolved-Wafer Proces...

    • ...Another solution is to play with DRIE process parameters during etch [1, 5], which will only work for some small-area suspended structures and for a limited etch period...

    S. E. Alperet al. Stepped-etching for preserving critical dimensions in through-wafer de...

    • ...The large air gap for the low-loss CPW line can be fabricated using the SOI wafer with preprocessed handle layer, which is similar to the silicon-on-glass process [28], [29]...

    Jaehong Parket al. A Non-Contact-Type RF MEMS Switch for 24GHz Radar Applications

    • ...Many high performance accelerometers with low noise floor have been reported [1-3], however, these reported accelerometers are only sensitive to single-axis...

    Y. W. Hsuet al. A low-g three-axis accelerometer IC

    • ...They are the SCREAM (single crystal reactive etching and metallization) process, the silicon-on-insulator (SOl) based process, the bulk silicon dissolved wafer process developed by Draper Laboratory and the deeply dissolved silicon-on-glass (DDSOG) process [1-4]...
    • ...The etch-back is an important procedure in DDSOG processes, not only to thin the device wafer to the desired thickness, but also to get smooth surface and uniform thickness across the entire wafer [2]...

    Lingyun Wanget al. Etch-back in DDSOG process by ultrasonic agitation and application to ...

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