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Research on Creep Properties of SnAgCuRE Lead-Free Soldered Joints

Research on Creep Properties of SnAgCuRE Lead-Free Soldered Joints,10.1109/ICEPT.2006.359657,Keke Zhang,Jie Yang,Yaoli Wang,Yanli Fan,Xin Zhang,Yanfu

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Research on Creep Properties of SnAgCuRE Lead-Free Soldered Joints   (Citations: 1)
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The creep properties and its rupture life of Sn2.5Ag0.7CuXRE lead-free soldered joints were separately investigated and forecasted under constant temperature by the means of single shear lap creep specimens and finite element method. The experiments show that the creep rupture life of Sn2.5Ag0.7CuXRE lead-free soldered joints can obviously increase with adding 0.1wt % RE, which is 8.4 times longer than that of Sn2.5Ag0.7Cu solder and is apparently higher than that of present commercial employed Sn3.8Ag0.7Cu solder. And the actual testing results of creep rupture life of Sn2.5Ag0.7CuXRE lead-free soldered joints are better in accord with the predicted results by finite element method
Conference: Electronic Packaging Technology, International Conference on - ICEPT , 2006
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