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Keywords
(2)
Equivalent Circuit
Signal Integrity
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Return via connections for extending signal link path bandwidth of via transitions
Return via connections for extending signal link path bandwidth of via transitions,10.1109/EMCEUROPE.2008.4786874,Xin Chang,Bruce Archambeault,Matteo
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Return via connections for extending signal link path bandwidth of via transitions
(
Citations: 5
)
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Xin Chang
,
Bruce Archambeault
,
Matteo Cocchini
,
Francesco De Paulis
,
V. Sivarajan
,
Yaojiang Zhang
,
Jun Fan
,
S. Connor
,
A. Orlandi
,
J. Drewniak
This paper discusses a fast and accurate way to assess the impact of signal vias where the return current must change reference planes, including the effect of a return current via placed various distances from the signal via. The
equivalent circuit
includes capacitance of the via anti-pad as well as cavity effects.
Conference:
International Symposium on Electromagnetic Compatibility - EMC Europe - EMCEUROPE
, 2008
DOI:
10.1109/EMCEUROPE.2008.4786874
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Citation Context
(3)
...The impacts of the number of ground vias and the spacing between signal and ground vias on the signal quality have been studied in [
11
]‐[14]...
Chih-Chun Tsai
,
et al.
Design of Microstrip-to-Microstrip Via Transition in Multilayered LTCC...
...For high-speed signal transitions in multilayer printed circuit boards (PCBs), vias are necessary to route a signal from one layer to another, or to connect integrated circuit (IC) devices to power/ground planes [
1
]-[2]...
Songping Wu
,
et al.
Investigation of crosstalk among vias
...The via model in Fig.1 takes into account both the capacitive effects of the via barrel with respect to the power planes and the power plane impedance through which the signal return current flows [
1
]...
V. Ricchiuti
,
et al.
An equivalent circuit model for the identification of the stub resonan...
References
(3)
Theory and experiment on microstrip antennas
(
Citations: 206
)
Y. T. Lo
,
D. Solomon
,
W. Richards
Journal:
IEEE Transactions on Antennas and Propagation - IEEE TRANS ANTENNAS PROPAGAT
, vol. 27, no. 2, pp. 137-145, 1979
Wave model solution to the ground/power plane noise problem
(
Citations: 76
)
Guang-Tsai Lei
,
Robert W. Techentin
,
Paul R. Hayes
,
Daniel J. Schwab
,
Barry K. Gilbert
Journal:
IEEE Transactions on Instrumentation and Measurement - IEEE TRANS INSTRUM MEAS
, vol. 44, no. 2, pp. 300-303, 1995
An efficient approach for power delivery network design with closed-form expressions for parasitic interconnect inductances
(
Citations: 47
)
Chen Wang
,
Jingkun Mao
,
Giuseppe Selli
,
Shaofeng Luan
,
Lin Zhang
,
Jun Fan
,
David J. Pommerenke
,
Richard E. DuBroff
,
James L. Drewniak
Journal:
IEEE Transactions on Advanced Packaging - IEEE TRANS ADV PACKAG
, vol. 29, no. 2, pp. 320-334, 2006
Sort by:
Citations
(5)
Design of Microstrip-to-Microstrip Via Transition in Multilayered LTCC for Frequencies up to 67 GHz
Chih-Chun Tsai
,
Yung-Shou Cheng
,
Ting-Yi Huang
,
Yungping Alvin Hsu
,
Ruey-Beei Wu
Published in 2011.
Signal/Power Integrity Analysis for Multilayer Printed Circuit Boards Using Cascaded S-Parameters
(
Citations: 1
)
Francesco de Paulis
,
Yao-Jiang Zhang
,
Jun Fan
Journal:
IEEE Transactions on Electromagnetic Compatibility - IEEE TRANS ELECTROMAGN COMPAT
, vol. 52, no. 4, pp. 1008-1018, 2010
Investigation of crosstalk among vias
(
Citations: 3
)
Songping Wu
,
Jun Fan
Published in 2009.
An equivalent circuit model for the identification of the stub resonance due to differential vias on PCB
V. Ricchiuti
,
F. de Paulis
,
A. Orlandi
Conference:
IEEE Workshop on Signal Propagation on Interconnects - SPI
, 2009
Eliminating via-plane coupling using ground vias for high-speed signal transitions
(
Citations: 4
)
Songping Wu
,
Xin Chang
,
C. Schuster
,
Xiaoxiong Gu
,
Jun Fan
Conference:
IEEE Topical Meeting on Electrical Performance of Electronic Packaging - EPEPS
, 2008