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Design Guideline
Signal Integrity
Transfer Function
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Signal integrity analysis of embedded planar EBG Structures
Signal integrity analysis of embedded planar EBG Structures,10.1109/APEMC.2010.5475786,Francesco de Paulis,Leo Raimondo,Antonio Orlandi
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Signal integrity analysis of embedded planar EBG Structures
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Francesco de Paulis
,
Leo Raimondo
,
Antonio Orlandi
This work analyzes the impact on the signal quality and integrity of embedded planar electromagnetic bandgap structures. The power integrity properties of these structures are related to the
transfer function
of the interconnects that are routed in between the layers forming the EBG configuration. Two cases are studied: the symmetrical and asymmetrical configuration of the EBG plane. Some design guidelines are developed and offered.
Conference:
International Zurich Symposium on Electromagnetic Compatibility - EMC Zurich
, 2010
DOI:
10.1109/APEMC.2010.5475786
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References
(6)
A novel electromagnetic bandgap (EBG) structure for mixed-signal system applications
(
Citations: 50
)
Jinwoo Choi
,
Vinu Govind
,
Madhavan Swaminathan
Conference:
IEEE Radio and Wireless Symposium formerly - RWS formerly RAWCON
, 2004
Fundamental mechanisms of coupling between planar electromagnetic bandgap structures and interconnects in high-speed digital circuits. Part I - microstrip lines
(
Citations: 11
)
F. De Paulis
,
A. Orlandi
,
L. Raimondo
,
G. Antonini
Conference:
International Symposium on Electromagnetic Compatibility - EMC Europe - EMCEUROPE
, 2009
A novel power plane with integrated simultaneous switching noise mitigation capability using high impedance surface
(
Citations: 131
)
Telesphor Kamgaing
,
Omar M. Ramahi
Journal:
IEEE Microwave and Wireless Components Letters - IEEE MICROW WIREL COMPON LETT
, vol. 13, no. 1, pp. 21-23, 2003
Design, modeling, and characterization of embedded electromagnetic band gap (EBG) structure
(
Citations: 4
)
Suzanne Huh
,
Madhavan Swaminathan
,
Fidel Muradali
Conference:
IEEE Topical Meeting on Electrical Performance of Electronic Packaging - EPEPS
, 2008
IR-DROP Analysis and Thermal Assessment of Planar Electromagnetic Bandgap Structures for Power Integrity Applications
(
Citations: 6
)
Francesco de Paulis
,
Leo Raimondo
,
Antonio Orlandi
Journal:
IEEE Transactions on Advanced Packaging - IEEE TRANS ADV PACKAG
, vol. 33, no. 3, pp. 617-622, 2010