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Heterogeneous integration technology for combination of different wafer sizes using an expandable handle substrate

Heterogeneous integration technology for combination of different wafer sizes using an expandable handle substrate,10.1109/MEMSYS.2011.5734413,F. Fors

Heterogeneous integration technology for combination of different wafer sizes using an expandable handle substrate   (Citations: 1)
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This paper reports on the realization of a novel method for batch transfer of multiple separate dies from a smaller substrate onto a larger wafer substrate by using a standard matrix expander in combination with adhesive wafer bonding and an elastic dice tape. We demonstrate the expansion and transfer of about 30000 chips from a 100 mm wafer to a 200 mm wafer with a 22 μm standard deviation of positioning accuracy. Fabrication, evaluation method and results are presented.
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